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TrendForce reports that NVIDIA has recently rebranded all its Blackwell Ultra products to the B300 series. Looking ahead to 2025, NVIDIA plans to strategically promote the B300 and GB300 lines—which utilize CoWoS-L technology—thereby boosting the demand for advanced packaging solutions.
TrendForce’s latest findings reveal that NAND Flash products have been impacted by weaker-than-expected seasonal demand in the second half of 2024, leading to a decline in wafer contract prices in Q3. This downward trend is projected to deepen, with prices expected to drop by more than 10% in Q4.
TrendForce’s latest findings reveal that weaker consumer demand has persisted through 3Q24, leaving AI servers as the primary driver of memory demand. This dynamic, combined with HBM production displacing conventional DRAM capacity, has led suppliers to maintain a firm stance on contract price hikes.
TrendForce’s latest findings show that recent economic data points to a steady cooling of inflation in the US market, prompting the Federal Reserve to cut interest rates by 50 basis points in September to prevent a potential economic slowdown or recession. Additionally, the complex geopolitical landscape and uncertainties surrounding the US presidential election could dampen consumer spending, posing a significant risk to year-end holiday demand. Consequently, TrendForce forecasts that total shipments of MLCCs will reach approximately 1.205 trillion units in 4Q24—representing a quarterly decline of 3.6%.
Concerns over a potential HBM oversupply in 2025 have been growing in the market. TrendForce’s Senior Vice President of Research, Avril Wu, reports that it remains uncertain whether manufacturers will be able to ramp up HBM3e production as planned next year. Additionally, the steep learning curve for achieving stable yields in HBM3e 12-Hi production makes it difficult to determine if a capacity surplus will occur.
