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TrendForce's latest findings reveal that demand for AI servers continues to accelerate the development of HBM technologies, with the three major suppliers actively advancing their HBM4 product roadmaps.
TrendForce’s latest research reveals that the surge in demand for AI servers is accelerating the pace at which major US CSPs are developing in-house ASICs, with new iterations being released every one to two years. In China, the AI server market is adjusting to new US export controls introduced in April 2025, which are expected to reduce the share of imported chips (e.g., from NVIDIA and AMD) from 63% in 2024 to around 42% in 2025.
TrendForce’s latest report on the semiconductor packaging and testing (OSAT) sector reveals that the global OSAT industry in 2024 faced dual challenges from accelerating technological advancements and ongoing industry consolidation. While ASE holdings and Amkor maintained leading positions, OSAT providers from China, such as JCET and HT-Tech, saw strong double-digit revenue growth—supported by government policies and domestic demand—posing a growing challenge to the existing market order.
TrendForce’s latest research shows that weakening demand in the automotive and industrial sectors has slowed shipment growth for SiC substrates in 2024. At the same time, intensifying market competition and sharp price declines have pushed global revenue for N-type SiC substrates down 9% YoY to US$1.04 billion.
TrendForce’s latest MLCC research report reveals that uncertainty surrounding the U.S.’ reciprocal tariffs—despite the 90-day grace period—continues to cloud the global economic outlook. Although MLCC suppliers have not been directly affected by the trade war, growing caution and risk aversion among businesses and end markets have disrupted supply-demand dynamics in the first half of 2025. This raises concerns that the typical seasonal boost in the second half may fail to materialize.
