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Made-in-China is accelerating its transition towards automation to address labor shortages amidst rising labor costs, low birth rates, and an aging population. At the same time, there is a push for manufacturing to progress towards higher-end production actuated by new quality productive forces, thus creating a demand for industrial robots with the goal of achieving domestic production.
AI technology is demonstrating great potential in the space industry. Current practical applications include optimization of fault detection, satellite payload remote sensing, satellite network management, and space robotics through AI/ML. These applications enhance the execution efficiency and safety of space missions. Additionally, effectively integrating AI systems with existing technologies and overcoming environmental constraints are key issues that need to be addressed in the future.
1. AI Models and Technologies Used
2. The Relationship Between Computing and ICs
3. The Impact of AI on the IC Industry
4. AI Deployment by Major IC Design Companies
5. TRI’s View
The explosive surge of generative AI (gen AI) has prompted global telecom operators to successively incorporate large language models (LLMs), and develop various services related to gen AI applications, whilst unfolding preliminary verifications on gen AI application scenes. Taiwanese telecom operators are also offering gen AI services as integrated solutions to enterprise users in the hope of improving their overall revenue.
Taiwans’ largest industrial-themed exhibition series, Intelligent Asia 2024, kicked off in late August for a four-day event. Out of the sub-exhibitions, the Taiwan Robotics and Smart Automation Exhibition (TAIROS 2024) garnered a sizeable amount of attention, with booth numbers growing nearly 30% compared to 2023. The event attracted major global robotics manufacturers and key supply chain players looking to capitalize on the growing momentum of industry giants like NVIDIA and Tesla investing in robotics.
TAIROS 2024 showcased advanced factory equipment and robots featuring high-level data analytics and autonomous learning capabilities as its key highlights. The exhibition focused primarily on robotic arms for manufacturing, with AI enhancements delivering benefits such as improved flexibility and optimized processes.
AI is becoming increasingly widespread, driving the rapid global expansion of data centers. This growth has led to an elephant flow in the network traffic of data centers, making Ethernet upgrades and updates a critical necessity for large-scale networking. This report focuses on trends in data center development and network infrastructure, emphasizing analyzing and exploring the optimal adoption of InfiniBand and RoCE (RDMA over Converged Ethernet) solutions.
The global automotive industry is accelerating innovation with a focus on EVs and autonomous driving technology, alongside software-defined vehicles. This vision of safety, efficiency, and sustainability is creating a new blue ocean for automotive sensors
As indicated by the survey of global market intelligence firm TrendForce, chip suppliers such as AMD have been actively involved in negotiations with TSMC and OSAT throughout 2Q24 on chip packaging using the FOPLP technology, with major partnership models and items shown below:
Model 1: OSATs transitioning from traditional packaging method to FOPLP when packaging consumer ICs: AMD is currently negotiating with PTI and ASE on PC CPUs, whereas Qualcomm is talking it over with ASE on PMIC. Prior to this wave of demand, MediaTek had been worked with PTI on PMIC, while Qualcomm was already a partner of ASE pertaining to PMIC.
Model 2: foundries and OSATs transitioning from 2.5D wafer level to panel level when packaging AI GPUs: AMD and NVIDIA are currently negotiating with TSMC and SPIL on packaging AI GPUs by switching from the existing 2.5D wafer level to panel level, followed by an expansion in chip packaging sizes.
Model 3: panel providers packaging consumer ICs: NXP and STMicroelectronics are negotiating with Innolux on PMIC products.
1. Global Trends in Mobile Base Station Development
2. AI Applications: Mobile Base Stations
3. TRI’s View
Optical module is an indispensable component for achieving optical communication. However, corresponding issues are becoming increasingly apparent alongside the continuously climbing usage and growing transmission performance. This report, aside from probing into the development bottlenecks of existing optical module solutions, also focuses on the dynamics of three major solutions - LPO, OBO, and CPO - and their supply chains.