Intel has unveiled its 18A-based Core Ultra 3-series “Panther Lake” processors at CES, but industry attention is already shifting to what comes next. According to Tom’s Hardware, CEO Lip-Bu Tan said in an Intel News video posted on X that the company is “going big time into 14A,” adding th...

Memory price increases are prompting smartphone makers to adjust their production plans. According to South China Morning Post, a global memory chip shortage has led China’s DreamSmart Group to cancel a planned handset launch, with the company confirming that its Meizu brand has scrapped the Meizu...

As previously reported by ZDNet, SK hynix is exploring plans for its first U.S. HBM packaging facility. Meanwhile, the memory giant is accelerating its domestic expansion, announcing today a KRW 19 trillion investment in a new advanced packaging fab, P&T7, at its Cheongju site. The facility is p...

SK hynix is expected to continue using its MR-MUF process for HBM4 16-high products. According to DealSite, the company evaluated adopting fluxless bonding for HBM4 16-high but ultimately opted to retain its existing advanced MR-MUF process, concluding that the technology remains premature given per...

Just days ahead of its January 15 earnings call, TSMC stepped up its U.S. push with a US$197 million land purchase for a future gigafab — a move that signals the foundry giant is preparing for another major wave of investment. The New York Times and The Wall Street Journal report that Washington i...