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2026-02-13

[News] NVIDIA May Relax HBM4 Specs as Samsung and SK hynix Reportedly Face Capacity, Yield Limits

Competition among memory suppliers in the HBM4 segment is heating up. According to ZDNet, Samsung Electronics edged ahead of SK hynix and Micron on the 12th by announcing its HBM4 mass-production shipments. Even so, the overall HBM4 supply dynamics this year are likely to hinge primarily on NVIDIA...

2026-02-13

[News] Kioxia Posts Record ¥543.6B Q3 FY25 Revenue, Confirms 2026 NAND Fully Booked

Kioxia reported its third-quarter earnings on February 12. As noted in its earnings presentation, for the three months ended December 31, 2025, the company posted record-high revenue of 543.6 billion yen, up 21.3% QoQ and 20.8% YoY. Net income reached 89.5 billion yen, up 114.9% QoQ and 17.3% YoY, w...

2026-02-13

[News] Applied Materials Guides April Quarter Above Estimates; Sees 20%+ Semi Growth in 2026, DRAM Leads

Despite booking a $252 million penalty tied to illegal equipment shipments to China, Applied Materials still delivered a confident outlook. According to Bloomberg, the company projected fiscal second-quarter revenue of about $7.65 billion — well above analysts’ consensus of $7.03 billion for the...

2026-02-13

[News] DeepSeek Expands Context Tenfold as Zhipu Rolls Out New Model in China’s AI Race

China’s AI model race is accelerating. According to South China Morning Post, Chinese AI start-up DeepSeek has upgraded its flagship model with a significantly expanded context window and more up-to-date knowledge, fueling anticipation for its next major release. As part of the upgrade, the rep...

2026-02-13

[News] Intel Reportedly Backs Out of 300mm Wafer Deal With Tower; Production Could Move to Japan

While Tower Semiconductor has just unveiled a silicon photonics partnership with NVIDIA, its ties with another major chipmaker appear to be unraveling. According to Israeli outlet CTech, Tower disclosed that Intel intends to withdraw from a 2023 production agreement under which the U.S. semiconducto...

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