Shortly after Denso withdrew its bid for Rohm in late April, the spotlight has shifted back to the proposed three-way power semiconductor alliance involving Rohm, Toshiba Device & Storage, and Mitsubishi Electric. But according to Nikkei xTECH, citing Rohm president Katsumi Azuma, negotiations a...

Samsung Electronics is reportedly developing a next-generation HBM packaging technology aimed at bringing high-performance on-device AI to mobile devices. According to ETNews, sources say the company is working on a “Multi Stacked FOWLP” technology that combines ultra-high-aspect-ratio copper pi...

As global AI competition intensifies, U.S. export controls on advanced AI chips remain under close scrutiny. According to Reuters, sources say the U.S. has approved around 10 Chinese companies to purchase NVIDIA’s second-most powerful AI chip, the H200, though no shipments have reportedly been del...

Foxconn, a key server supplier to NVIDIA and major assembler for Apple, reported a strong first quarter, posting net profit of NT$49.919 billion and record sales of NT$2.12 trillion, with EPS rising 17% year on year to NT$3.56 and gross margin improving to 6.18%, according to its press release. C...

TSMC held its Taiwan Technology Symposium today. According to Reuters, the company said that demand for AI accelerator wafers is projected to grow 11-fold between 2022 and 2026. TSMC also raised its forecast for the global semiconductor market, now expecting it to exceed US$1.5 trillion by 2030, up ...