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2026-08-18

[News] Samsung Reportedly Eyes Another Wide Fold for 2027 After Fold8 Success; Memory Costs Still Weigh on Mobile

Samsung is reportedly preparing another “wide fold” model for next year as demand for the form factor gains traction. According to ETNews, industry sources say the company has initiated two wide-fold development projects for the Galaxy Z9 series and shared the plans with suppliers. Alongside a t...

2026-08-18

[News] CXMT DDR5 Reportedly Tops 9,000 MT/s on AMD Platform, Narrowing Performance Gap With Global Leaders

China’s DRAM maker CXMT is advancing at a rapid pace. According to TechPowerUp, Colorful’s CXMT-based DDR5 memory has surpassed 9,000 MT/s on an AMD platform, highlighting improving overclocking potential. A 48GB (24GB×2) iGame Shadow II kit running on Colorful’s iGame X870E VULCAN W OC mothe...

2026-08-18

[News] MLCC Lead Times Diverge as High-End Products Stretch to 5–10 Months; Tightness May Extend Into 2027

AI-driven demand is tightening the MLCC market, with supply conditions increasingly diverging between standard and high-end products. According to ETNews, lead times for standard-case MLCCs remain relatively stable at 14–18 weeks, or about 3.5–4.5 months, while high-capacitance and high-voltage ...

2026-08-18

[News] NVIDIA Vera Rubin Spillover from HBM to NAND: CMX Fuels TLC Spot Price Rebound from June Dip

As NVIDIA’s Vera Rubin ramps up, its memory impact is extending beyond HBM into NAND. Alpha Economy reports that stronger Rubin production is tightening TLC NAND supply-demand, with the 512Gb TLC NAND spot price rebounding from its June dip to $21.125 on Aug. 17. Citing DRAMeXchange, the report...

2026-08-18

[News] The Second Half of the AR Glasses Race Begins

In the first half of 2026, the AR glasses industry entered a stage of accelerated commercialization. The integration of AI foundation models and near-eye display technologies has gathered momentum, with global tech giants and domestic innovators launching new products in quick succession. Capital co...

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