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2026-08-18

[News] MLCC Lead Times Diverge as High-End Products Stretch to 5–10 Months; Tightness May Extend Into 2027

AI-driven demand is tightening the MLCC market, with supply conditions increasingly diverging between standard and high-end products. According to ETNews, lead times for standard-case MLCCs remain relatively stable at 14–18 weeks, or about 3.5–4.5 months, while high-capacitance and high-voltage ...

2026-08-18

[News] NVIDIA Vera Rubin Spillover from HBM to NAND: CMX Fuels TLC Spot Price Rebound from June Dip

As NVIDIA’s Vera Rubin ramps up, its memory impact is extending beyond HBM into NAND. Alpha Economy reports that stronger Rubin production is tightening TLC NAND supply-demand, with the 512Gb TLC NAND spot price rebounding from its June dip to $21.125 on Aug. 17. Citing DRAMeXchange, the report...

2026-08-18

[News] The Second Half of the AR Glasses Race Begins

In the first half of 2026, the AR glasses industry entered a stage of accelerated commercialization. The integration of AI foundation models and near-eye display technologies has gathered momentum, with global tech giants and domestic innovators launching new products in quick succession. Capital co...

2026-08-18

[News] Shinko Electric Advances 22-Layer Glass Substrates; Samsung Electronic Mechanics Faces Ramp-Up Uncertainty

The glass substrate race is heating up as AI chips demand larger packages, with South Korean and Japanese players racing to gain an early edge. According to Seoul Economic Daily, Japan’s Shinko Electric Industries has developed a 22-layer glass substrate by stacking 11 copper wiring layers on each...

2026-08-17

[News] Samsung, SK hynix 1H26 Chip Facility Investment Up 35%; NVIDIA Not Among Samsung’s Top Five Customers

Samsung and SK hynix are accelerating semiconductor investment as AI demand drives capacity expansion and advanced-process upgrades. According to Etoday, citing the companies’ 2026 semi-annual reports, Samsung Electronics and SK hynix invested a combined KRW 43.198 trillion in semiconductor facili...

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