AI-driven demand is tightening the MLCC market, with supply conditions increasingly diverging between standard and high-end products. According to ETNews, lead times for standard-case MLCCs remain relatively stable at 14–18 weeks, or about 3.5–4.5 months, while high-capacitance and high-voltage ...

As NVIDIA’s Vera Rubin ramps up, its memory impact is extending beyond HBM into NAND. Alpha Economy reports that stronger Rubin production is tightening TLC NAND supply-demand, with the 512Gb TLC NAND spot price rebounding from its June dip to $21.125 on Aug. 17. Citing DRAMeXchange, the report...

In the first half of 2026, the AR glasses industry entered a stage of accelerated commercialization. The integration of AI foundation models and near-eye display technologies has gathered momentum, with global tech giants and domestic innovators launching new products in quick succession. Capital co...

The glass substrate race is heating up as AI chips demand larger packages, with South Korean and Japanese players racing to gain an early edge. According to Seoul Economic Daily, Japan’s Shinko Electric Industries has developed a 22-layer glass substrate by stacking 11 copper wiring layers on each...

Samsung and SK hynix are accelerating semiconductor investment as AI demand drives capacity expansion and advanced-process upgrades. According to Etoday, citing the companies’ 2026 semi-annual reports, Samsung Electronics and SK hynix invested a combined KRW 43.198 trillion in semiconductor facili...