Kim Jung-Ho, a professor at KAIST and widely known as the “father of HBM (High Bandwidth Memory),” recently made a striking statement on a YouTube program: “In the AI era, the balance of power is shifting — from GPU to memory.” According to Kim, memory will play an increasingly pivotal ...

After solidifying its leadership in HBM, SK hynix is teaming up with SanDisk to develop High-Bandwidth NAND Flash (HBF), which enhances HBM with NAND for AI inference workloads. At the same time, the company is reportedly exploring a broader memory spectrum: High-Bandwidth Storage (HBS). As ETnews r...

Samsung is moving forward with its Exynos comeback, aiming to reduce its dependence on Qualcomm chips. According to Chosun Biz, citing sources, Samsung Electronics plans to use the Exynos 2600 in the base and Plus models, while the Ultra model will continue to feature Qualcomm’s mobile application...

AI is fueling a surge in demand for advanced packaging, and TSMC’s capacity in this segment is reportedly running tight. According to Economic Daily News, with most of TSMC’s advanced packaging capacity taken up by NVIDIA, several major U.S. AI chipmakers have rushed to seek help from Powertech,...

While Micron has already sold out its 2026 HBM supply, the company appears to be taking a cautious approach to capacity expansion. According to syracuse.com and Spectrum News 1, the opening of its first two chip fabs in Clay, New York, will be delayed by two to three years, meaning neither facility ...