Coinciding with SK hynix’s KRW 54.3 trillion investment in the Yongin Y2 and Cheongju M17 fabs, Bloomberg reports that the memory giant is considering bringing in external investors or selling a stake in its Chongqing semiconductor packaging plant, valued at around KRW 4 trillion ($3 billion). The...

TSMC continues to expand its global manufacturing footprint as its partnerships with major international players deepen. According to Nikkei, sources say Sony Group and TSMC plan to begin mass production of next-generation image sensor chips in Kumamoto Prefecture, southwestern Japan, as early as 20...

TSMC is reportedly looking to accelerate its advanced packaging expansion by securing existing manufacturing infrastructure near its key production hubs. According to Economic Daily News, sources say TSMC plans to acquire AUO’s L7 and L5C fabs near its Central Taiwan Science Park facilities to exp...

As growth in general-purpose DRAM prices is expected to moderate, the memory race is shifting toward next-generation HBM, with the three major memory makers stepping up their efforts. According to Seoul Economic Daily, Samsung’s HBM4 yield has climbed to 80% from below 60% when mass production beg...

Recently, Shenzhen MTC and Guangdong Ellington Electronics have successively advanced their presence in high-end printed circuit boards (PCBs). Focusing on key application segments such as Mini/Micro LED, optical communications, and AI servers, both companies are accelerating the expansion of their ...