SK hynix is reportedly exploring cooperation with Intel in advanced 2.5D packaging, a move that could signal potential shifts in the AI chip packaging supply chain. According to ZDNet, sources say SK hynix is conducting R&D on Intel’s EMIB-based 2.5D packaging technology using its own HBM, whi...

As China pushes to strengthen its chip industry, Richard Chang, founder of SMIC, China’s largest foundry, suggests that success in semiconductors is not solely about winning the 2nm or 3nm race, with niche markets potentially emerging as a key competitive advantage for China. According to STAR Mar...

Analog IC leaders Texas Instruments and NXP both issued upbeat guidance for the current quarter, while market-circulated reports suggest the two are also moving in parallel on pricing actions. According to Sina and eTime, citing company notices, TI is set to launch its second round of price hikes th...

At Carnegie Mellon University’s honorary doctorate ceremony, Lip-Bu Tan personally congratulated Jensen Huang on receiving an honorary doctorate in science and technology, drawing fresh industry attention to the growing ties between Intel and NVIDIA. According to Wccftech, Tan not only praised Hua...

While recent market chatter has focused on a potential shift by Apple between longtime foundry partner TSMC and Intel, the Economic Daily News, citing industry sources, reports that the Cupertino-based company remains heavily dependent on the Taiwanese foundry giant, as it plans to place its entire ...