As AI packages expand to accommodate more compute and memory, managing heat is becoming increasingly important for next-generation HBM. According to Chosun Biz, the interposers connecting compute chips and HBM are expected to grow dramatically in size, while Samsung Electronics is preparing a range ...

Samsung is reportedly pulling back from automotive application processors (APs) as it restructures its chip design business and shifts resources toward areas with stronger profitability and market-share potential. According to Munhwa Ilbo, sources say Samsung has decided to exit the automotive AP bu...

NVIDIA’s NVHBM, announced in August, could mark a turning point for custom HBM. By moving the memory controller into the HBM base die, the architecture gives base dies a bigger role—and is already reshaping how memory makers source them. Against this backdrop, Micron and Samsung are already s...

AI companies and their infrastructure partners are increasingly turning to debt financing to fund massive chip purchases as they expand AI capacity. According to Bloomberg, Broadcom has held preliminary discussions on arranging financing to help OpenAI purchase the custom AI chips the two companies ...

Ahead of its October 15 earnings call, TSMC reported September revenue of NT$511.86 billion, topping NT$500 billion for the second straight month. The strong finish propelled third-quarter revenue to a record NT$1.49 trillion (US$46.71 billion), up 50% year over year and beating market expectations,...