Recently, DeepSeek released a preview version of DeepSeek-V4 and simultaneously open-sourced its model weights. This marks a significant technological upgrade: two model variants, million-token context length, and ultra-low inference cost, which all draw strong industry attention. Notably, Chinese A...

As competition in the foldable smartphone market intensifies, new details about Xiaomi’s next foldable device have begun to surface, with its chip strategy drawing close industry attention. According to Mydrivers, sources say a Xiaomi foldable smartphone with the model number 2608BPX34C has appear...

Competition for leadership in next-generation memory technology, Compute Express Link (CXL), is intensifying among global memory makers. According to Hankyung, sources say CXL could emerge as the next key battleground after HBM, with Samsung recently unveiling a new system delivering up to 10× perf...

The AI compute race is heating up, pushing advanced packaging to the forefront, with TSMC’s CoWoS emerging as one of the most constrained resources in the global AI supply chain. According to Commercial Times, sources say the average selling price (ASP) of a single CoWoS wafer is around $10,000—...

Global memory makers’ shift toward high-capacity products is reshaping the market, with Taiwan’s Macronix emerging as a key beneficiary. According to Economic Daily News, following Samsung’s exit from MLC NAND, Macronix’s NAND revenue share jumped from 21% to 30% in the first quarter of 2026...