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As international geopolitical risks rise, Apple is beginning to face the issue of supply chain relocation. Since 2000, Apple has established a complete supply chain layout in China. Before the outbreak of the epidemic, the assembly factory located in Zhengzhou of Henan provided sufficient production capacity for iPhones every year, allowing the products to be exported worldwide. However, the factory's capacity utilization rate continued to decline after the outbreak of the epidemic. In November 2022, a large-scale protest erupted due to some employees' dissatisfaction with wages and epidemic restrictions, leading to serious problems in the supply chain. Apple realized that it could no longer concentrate a large amount of production capacity on a single supplier or region, so it accelerated the relocation of its supply chain.
Demand for large panel driver ICs is set to rise sequentially throughout 2024, with ample overall supply. However, uncertainty in end-user demand has led to conservative stocking practices in the supply chain, fostering a reliance on short-term, rush orders—a practice that threatens long-term supply chain health.
In 2023, mobile TDDI chips benefited significantly from active repair and second-hand markets, resulting in annual shipments far exceeding intial forecasts. The release of lower-cost capacities by Chinese wafer foundries has helped sustain robust demand for mobile TDDIs through 2023 to 2024. Nonetheless, intense comptition in this segment has escalated price wars.
For AMOLED driver ICs, the introduction of new production capacities has boosted demand as AMOLED smartphone panel penetration increases. Currently, the market faces no-short-term supply shortages. As more suppliers enter the AMOLED DDI market, prices continue to decline. Maintaining profitability in AMOLED DDI production remains a critical challenge for IC manufacturers, especially with stable wafer prices.
As global internet data transmission volume continues to reach new highs, the performance bottleneck of light communication solutions becomes increasingly apparent. This report, on the one hand, explores the shortcomings of existing light communication solutions. On the other hand, it focuses on silicon photonics and CPO technology, analyzing their competitive advantages in the field of light communication, and keeping track of the development dynamics of key manufacturers.
The US-China trade war has been ongoing for several years, significantly impacting the semiconductor industry due to the US imposing numerous restrictions on China. Semiconductors, essential for smartphones, have notably hindered the progress of China’s smartphone sector amid these sanctions.
Huawei was particularly affected during this standoff between the US and China. The sanctions led to a market decrease in Huawei’s market share, prompting other Chinese smartphone manufacturers to aggressively pursue the high-end market. However, the situation escalated on August 29, 2023, when Huawei unveiled its 5G Mate 60 Pro, stirring further tensions with the US. This move highlights how the smartphone development conflict has transitioned from mere brand competition to a pivotal aspect of the technological struggle between the US and China.
AI technology has become a new industry trend after OpenAI released ChatGPT, and this trend has now extended to the smartphone field. Current observations find that in-house large language models (LLMs) have become the major competing category for brands, who are showcasing the performance of their models in areas such as language comprehension and image recognition. AI on edge computing solutions are expected to become the industry's development direction when the requirements of user privacy and latency reduction in data transmission emerge after the official boom of AI capabilities in smartphones.
1. Development of Global AI Industry Chain
2. Analysis of Cross-Modal Business Opportunities in AI
3. A Breakdown of Hardware Supply Chain
4. TRI’s View
1. Global Overview of the AI Market Development
2. The Necessity of Openness in AI Development
3. Current Applications and Development of AI
4. TRI’s View
The IEEE officially released the 802.11bb standard in July 2023, thereby providing a definition for the mutual support specifications of Light Fidelity (Li-Fi) devices. With the publication of this standard for wireless communication, the major Li-Fi technology providers have been actively exploring the related crucial application scenarios and developing corresponding solutions. Additionally, Li-Fi is expected to play a vital role in achieving comprehensive terrestrial network coverage in the 6G era.
1. Development of Global Fixed Broadband Industry
2. Development of Global Mobile Broadband Industry
3. Development Trends of Global LEO Satellite Industry
4. TRI’s View
In the past, Huawei had maintained a strong position in the global smartphone market, stably ranking among the top three in market share, thanks to the differentiation advantage of its self-developed Kirin SoC chip. However, since May 2019, Huawei has been heavily impacted by the US sanctions and has been unable to access high-end 5G chips. As a result, Huawei's market share in the smartphone industry has experienced a significant decline. The market initially believed that the US sanctions would severely impact Huawei and its smartphone supply chain, potentially pushing Huawei into a dire situation. However, Huawei has made a comeback by launching the new Mate 60 Pro, which supports 5G technology. This comeback is a testament to the Nietzsche saying, "What doesn't kill me makes me stronger."
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