As global computing power expands, traditional cabling faces severe thermal and power bottlenecks. Emerging Micro LED CPO technology, with its micron-level size and ultra-low power consumption, has become an ideal alternative for short-distance high-speed transmission in data centers. Despite processing hurdles and fierce competition, supply chain alliances are expected to drive mass production and substantial market value in the coming years.
With our expertise in the memory market, this provides a comprehensive analysis and forecast on HBM market share, ASP, wafer capacity, demand consumption, etc.
CSP capex growth lifts server and AI shipments, chip forecasts rise, ODMs shift to racks, cooling gains traction.
AI chip demand surges in 2026, with high-end GPUs dominating. NVIDIA leads, ASICs gain share, liquid cooling expands, and AI server value hits record highs.
Photonic packaging drives AI infra, shifting to mass production. CPO and glass platforms solve bottlenecks.
Analyst View: Anticipating future supply shortages, buyers are actively replenishing server memory inventories, boosting suppliers' pricing power. Although long-term agreement price caps limit average gains, contract prices are projected to sustain a quarterly upward trend driven by extra demand.
TrendForce combines its expertise in the Foundry/Server industry and leverages it with the supply chain to accurately estimate AI chip shipments, AI Server application ratios, AI major suppliers' analysis, and the adoption of AI memory.
TrendForce combines its expertise in memory market and leverage it to provide a multi-faceted study of server market in this report. The content of it is as follows:
1. Server CPU Market: State of Competition and Market Shares
2. Server Procurement by Cloud Service Providers in North America and China
3. Projection on Shipments of Server Storage Products
4. Projection on Server Shipments for Current Year
5. Major ODM Partners of Critical Server Brands
6. Changes on Volumes in Server DRAM Procurement
7. Trends in SSD Procurement and Projections on Storage Form-Factors and Interfaces
8. Shares of Enterprise and Hyperscaler Servers in Memory Consumption.
The surge in demand for AI chips and high-speed servers is driving the demand for high-end fiberglass cloth. However, constrained by technical barriers, equipment bottlenecks, and yield challenges, the release of new capacity remains slow, resulting in a persistent supply-demand imbalance for critical materials. Consequently, high-end products are expected to remain in short supply in the short term.
AI drives data centers from air to liquid cooling. Vendors deploy high-density power and tech, boosting growth.