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TSMC, UMC, Vanguard and PSMC posted higher 2Q26 revenue on price hikes and strong demand, with capex broadly raised.
China's lithography drive poses little threat to ASML, but other mature-node process gains erode Western and Japanese rivals' revenue.
A major quake hit TSMC's JASM fab in Kumamoto, forcing a brief halt, but damage looks contained and impact stays limited.
AI demand reshapes foundry priorities: photonics, packaging gains, tight mature nodes, rising power investment.
Major foundries push fab buildouts, transfer orders, price talks, and specialty processes to boost capacity.
The Diamond reports cover major foundries such as TSMC, UMC, Samsung, SMIC, and GlobalFoundries, etc. The Diamond reports provide extended analyses of these foundries' production capacity figures, process node migration and capacity utilization rates. Furthermore, the Diamond reports discuss the competition among foundries and among major regional markets, including Mainland China, Taiwan, South Korea, Japan, etc. The dynamics of competition and cooperation, together with capacity utilization rates of specific nodes, wafer prices, wafer input from major clients at advanced nodes, etc., are all especially highlighted in the Diamond reports
AI-driven demand displaces mature node capacity, triggering price hikes across 8-inch and 12-inch foundry that could last through 2027.
AI-driven advanced packaging demand is reshaping the probe card market, boosting margins and triggering a major shift in global supplier rankings.
AI-driven HPC demand has elevated probe card technology, from MEMS upgrades to silicon interposers, while ATE leaders accelerate vertical integration.
Foundry pricing trends tighten across mature nodes in 2026, with AI demand driving advanced-process overflow orders and reshaping competitive dynamics.
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