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AI-driven HPC demand has elevated probe card technology, from MEMS upgrades to silicon interposers, while ATE leaders accelerate vertical integration.
Foundry pricing trends tighten across mature nodes in 2026, with AI demand driving advanced-process overflow orders and reshaping competitive dynamics.
Taiwan foundries including TSMC, UMC, Vanguard, and PSMC are raising prices amid tight capacity, with increases set to extend into 2027.
Taiwan foundries including TSMC, UMC, Vanguard, and PSMC are raising prices amid tight capacity, with increases set to extend into 2027.
The Platinum reports provide analyses of the foundry industry, starting from TrendForce’s memory industry analysis and application demand in the downstream, extending to the semiconductor upstream, encompassing wafer production capacity, process node roadmap, and capacity utilization of each fab. The Platinum reports provide detailed analyses of foundries' competitiveness and capacity utilization rates, specifically focusing on major players including TSMC, UMC, Samsung, SMIC, and GlobalFoundries, etc.. The Platinum reports also discuss the future outlook of the foundry market.
Major foundries see rising utilization and pricing power, driven by front-loading demand and surging AI orders, lifting 2026 full-year outlook.
Taiwan foundries see strong 2Q26 rebound, led by TSMC's 3nm ramp and packaging, with peers eyeing HBM and interposer.
Intel 18A yield beats plan, 14A wins Tesla. Niche logic with EMIB/Foveros and PowerVia could reshape foundry race.
Mature foundries shift structurally as capacity cuts and AI demand lift utilization and pricing, while Tier 2 players gain order wins.
AI demand reshapes chip supply; advanced nodes and packaging turn scarce, with early lockdowns now defining leadership.
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