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AI drives TSMC's expansion and upgraded targets. Vanguard sees rising utilization and prices via power ICs. UMC grows steadily, while PSMC rebounds through memory demand.
Driven by accelerated 8-inch capacity cuts by TSMC and Samsung, coupled with rising demand for AI power components and panic stocking across the supply chain, the global supply-demand structure for 8-inch wafers is tightening. This significant rebound in utilization rates has prompted major Chinese, Korean, and Taiwanese foundries to initiate price hike strategies.
Intel is expanding advanced packaging globally to secure CSP orders but trails TSMC in yield and turnkey solutions. Despite EMIB's technical challenges, the growing AI market offers opportunities for both, moving beyond a zero-sum game.
NVIDIA's H200 supply upside is limited by tight advanced packaging and memory capacity prioritized for new platforms. While targeting the Chinese market, geopolitical risks are driving China to accelerate domestic chip autonomy and in-house ASIC development, expanding local market share.
Samsung to focus on advanced nodes in 2026 with full capacity utilization; SMIC to raise 8-inch and memory foundry prices on strong demand; HuaHong to expand capacity and advance specialty platforms; GlobalFoundries to develop automotive BCD and 22nm Bulk CMOS to win orders; Nexchip to outperform peers on localization and ramp OLED driver IC mass production with tier-one customers.
The Diamond reports cover major foundries such as TSMC, UMC, Samsung, SMIC, and GlobalFoundries, etc. The Diamond reports provide extended analyses of these foundries' production capacity figures, process node migration and capacity utilization rates. Furthermore, the Diamond reports discuss the competition among foundries and among major regional markets, including Mainland China, Taiwan, South Korea, Japan, etc. The dynamics of competition and cooperation, together with capacity utilization rates of specific nodes, wafer prices, wafer input from major clients at advanced nodes, etc., are all especially highlighted in the Diamond reports
The recent Taiwan earthquake caused brief stoppages and minor wafer scrap in northern fabs. With no major facility damage and spare capacity available for makeup, operations are recovering strictly. The overall financial and operational impact is assessed as minimal.
TSMC reduces 8-inch capacity to focus on advanced processes; UMC sees rising utilization from AI and future Samsung transfer opportunities. Vanguard acquires TSMC's used equipment to meet strong power IC demand; PSMC advances projects and plans fab leasing to optimize profits.
Memory price surge continues into 1Q26, pushing BOM cost to a critical point. Brands freeze price cuts and downsize specifications, facing severe sales challenges.
The foundry sector is undergoing a broad realignment as mature nodes contract, product mixes shift upward, and Chinese demand supports steady growth. Advanced-node expansion continues to face technical constraints.
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