The Platinum reports provide analyses of the foundry industry, starting from TrendForce’s memory industry analysis and application demand in the downstream, extending to the semiconductor upstream, encompassing wafer production capacity, process node roadmap, and capacity utilization of each fab. The Platinum reports provide detailed analyses of foundries' competitiveness and capacity utilization rates, specifically focusing on major players including TSMC, UMC, Samsung, SMIC, and GlobalFoundries, etc.. The Platinum reports also discuss the future outlook of the foundry market.
2Q26 foundry revenue rose broadly; overseas, China fab expansion should keep capacity tight, lifting full-year momentum.
TSMC, UMC, Vanguard and PSMC posted higher 2Q26 revenue on price hikes and strong demand, with capex broadly raised.
China's lithography drive poses little threat to ASML, but other mature-node process gains erode Western and Japanese rivals' revenue.
A major quake hit TSMC's JASM fab in Kumamoto, forcing a brief halt, but damage looks contained and impact stays limited.
AI demand reshapes foundry priorities: photonics, packaging gains, tight mature nodes, rising power investment.
Major foundries push fab buildouts, transfer orders, price talks, and specialty processes to boost capacity.
AI-driven demand displaces mature node capacity, triggering price hikes across 8-inch and 12-inch foundry that could last through 2027.
AI-driven advanced packaging demand is reshaping the probe card market, boosting margins and triggering a major shift in global supplier rankings.
AI-driven HPC demand has elevated probe card technology, from MEMS upgrades to silicon interposers, while ATE leaders accelerate vertical integration.
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