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As U.S. export controls extend from chips to AI infrastructure, the traditional optical interconnect industry is undergoing supply chain restructuring. While optical modules are not subject to blanket bans, they are now governed by system‑level controls. By leveraging its semiconductor ecosystem and investing in SiPh, CPO, advanced packaging and testing capabilities, Taiwan can capture North American supply‑chain de‑risking demand and reposition itself as a strategic AI partner.
Intensifying global geopolitical conflicts are driving up defense spending, and warfare is pivoting toward asymmetric and information warfare, making low-cost unmanned vehicles (UAVs) crucial. China is deepening military-civilian integration to break through technology controls, while Taiwan is fully developing localized UAV and AI defense supply chains to strengthen resilience.
In AI inference, MoE architectures and long-context processing have sharply increased memory-capacity requirements for model weights and KV cache, shifting the bottleneck from insufficient compute to limited memory capacity. As warm data grows rapidly, this will drive a restructuring of the storage hierarchy, where HBM will handle hot data, while HBF will carry warm data to optimize cost–performance. However, commercialization of HBF still needs to overcome challenges in advanced packaging processes and the inherent characteristics of NAND flash.
With the generative AI market expanding at a CAGR of over 35%, data throughput for a single large language model (LLM) training task has reached the exabyte (EB) level. As transmission speeds evolve toward 1.6Tbps, traditional copper cables are hitting a “physical wall,” limiting transmission distances to under one meter and creating a massive energy drain. Leveraging cross-domain technologies like TSMC’s Compact Universal Photonic Engine (COUPE) advanced packaging and Micro LED mass transfer, Taiwan’s supply chain has built a comprehensive ecosystem—spanning wafer foundries and ASIC design to photoelectric testing. Consequently, Taiwan has become an indispensable strategic hub in the global AI computing infrastructure.
For the current year of 2026, TSMC plans to establish a trial production line CoPoS through its subsidiary, VisEra, with trial production scheduled for 2027. Consequently, this year will be a critical window for product validation and deliveries for related equipment and material providers. To address the warpage issues inherent in large-area panel-level packaging (PLP), specialty chemical suppliers such as AMC, WaferChem, and Everlight Chemical showcased corresponding solutions at Touch Taiwan 2026, drawing significant market attention.
Accordingly, this report provides an in-depth analysis of: (1) the background of the material technology PLP and its market outlook; (2) the causes of warpage and potential solutions; and (3) warpage-suppressing materials and key suppliers. The objective is to clarify the demand drivers for PLP, the mechanisms behind panel warpage, viable countermeasures, and the emerging business opportunities for Taiwan-based companies.
In 2026, power semiconductors have evolved from conventional components into strategic enablers reshaping the global energy landscape. SiC and GaN technologies are entering a phase of large-scale deployment across global infrastructure as AI data centers confront the “power wall” bottleneck and EVs accelerate the adoption of 800V high-voltage architectures.
NVIDIA once again showcased its Rubin-series chips and rack systems—scheduled for launch by the end of 2026—at GTC 2026 on March 16th. Compared to the previous generation, the Rubin series boasts significantly larger substrate sizes, higher layer counts, and increased rack board complexity.
Furthermore, the shift toward cableless design architectures is driving demand for components such as midplanes and orthogonal backplanes, while the introduction of the inference-focused Rubin LPX rack is further boosting demand for high-end glass fiber cloth.
However, the supply side is facing severe constraints. Nittobo, which controls approximately 90% of the global T-glass market and 60–70% of the NER-glass market, is not expected to bring new capacity online until mid-2027 at the earliest. This implies that supply gaps for critical materials will persist over the next year, with direct implications for lead times and cost trends across the AI server supply chain. This issue warrants close attention from all industry stakeholders.
This report provides an in-depth analysis of:
(1) The technology background and development of glass fiber cloth;
(2) AI-driven demand trends for glass fiber cloth;
(3) Nittobo’s capacity bottlenecks and their impact on pricing.
The objective is to offer a comprehensive view of demand momentum, pricing trends, and competitive dynamics in the high-end fiberglass cloth market.
AI demands and chip upgrades drive smartphone storage growth despite high costs. Brands raise base specs, making large capacities the new standard.
With Google, Meta, and MediaTek all considering adopting Intel’s EMIB packaging technology, Intel’s technological progress in advanced packaging and glass substrates has once again attracted significant attention in the industry. In particular, Intel showcased the first sample at NEPCON Japan on January 22nd 2026 that combines Intel’s EMIB packaging with a glass substrate, capable of supporting a chip twice the reticle size, with bump pitch shrunk to 45µm, and claimed to have achieved No SeWaRe (no micro‑cracks) during testing, implying that glass substrates are one step closer to mass production. On the other hand, besides Intel, TSMC, Samsung (SEMCO), Rapidus, and SK Absolics are also expected to achieve mass production of glass substrates successively between 2027 and 2028.
This report mainly provides in‑depth analysis of: (1) trends in large‑size chip packaging; (2) the advantages of glass substrates; (3) the glass substrate technology roadmaps of major foundries/OSATs; (4) challenges in mass production of glass substrates; (5) glass substrate solutions and corresponding suppliers; and (6) an overview of the glass substrate supply chain and opportunities for Taiwanese manufacturers. This report analyzes current demand drivers for glass substrates, technological bottlenecks, supplier performance, and potential supply‑chain opportunities for Taiwanese companies.
DRAM industry will focus on HBM capacity expansion, with Chinese suppliers limited by equipment restrictions; major players like Samsung, SK hynix, and Micron emphasize tech migration and AI applications, intensifying HBM competition where HBM4 validation will shape market shares, while conventional DRAM relies on tech upgrades for growth.
