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This report offers a comprehensive analysis of the competitive landscape in the AI server market, providing a forecast for 2024 and identifying key factors driving future trends. It further delves into the strategies adopted by China’s AI server industry to navigate the constraints on advanced AI chips, with a specific focus on developments in GPU, ASIC, and HBM chips.
An increase in demand for 5G Fixed Wireless Access (FWA) was seen throughout 2023 to complement last-mile wired broadband deployments. This will bring 5G experiences to homes, businesses, factories, and other areas. 5G FWA also helps to bridge the digital divide in rural areas by providing fast and cost-effective broadband access. FWA enhances the feasibility of wireless as a home broadband solution, which in turn drives opportunities for 5G FWA device manufacturers. The analysis on the global 5G FWA chip market is as follows.
1. Business Performance Comparison
2. Products Comparison
3. Chip Performance Comparison
4. Other Competitors
5. TRI’s View
GaN components, already excelling in rapid charging for end devices, are now becoming more prominent in the automotive and network communication sectors. This report delves into the growth potential of GaN components within the automotive industry, pinpoints their primary applications, and centers on the emerging market for automotive GaN components in China, spotlighting prospects for the country's local supply chain.
Smart home devices, now more common than ever, are bringing an array of AI capabilities into our daily routines, heralding the beginning of an era focused on large-scale personalization. To function effectively, smart homes rely not just on smart appliances but also on a variety of sensors and energy management systems, contributing to the growth of IoT devices in homes. These devices typically use Tiny Machine Learning (TinyML) on Microcontroller Units (MCUs), which is suited for their limited power and size in consumer applications. AI chips are employed within these devices to provide quick computing, tailored to individual AI needs.
AIGC is being comprehensively implemented and gradually entering human life. Currently, major technology companies, leading application service providers, numerous startups, and national institutions are actively involved due to the profound impact anticipated from the application of AIGC. This report primarily focuses on the development of the upstream supply chain in the AIGC industry, specifically on AI framework developers, AI model developers, IC design houses, IC manufacturing, and OSATs, in order to grasp on industry trends.
The load of cloud computing will continue to elevate under the advancement of diversified applications, where restricted growth of performance in DDR SDRAM could encumber the performance of computing systems, which allows HBM to further exert its abilities. This report probes into the demand background and development tendencies of HBM, and focuses on the 2.5D packaging technology that integrates HBM.
Values of AI servers and corresponding computing cores GPGPU (General-Purpose Computing on Graphics Processing Unit) in parallel computing as LLM (Large Language Model), which excels in NLP (Natural Language Processing), and diffusion model, which excels in image processing, march towards mass commercialization, have become essential drivers for the human society in improving productivity through technical advancement.
Among which, AI servers possess a higher degree of customization compared to that of cloud servers. Taiwanese ODMs, including Foxconn Industrial Internet, Inventec, MiTAC, Wistron, Wiwynn, and Quanta, are once again portraying essential roles in the supply chain for AI servers with their capabilities in customization, while server OEMs such as Dell, Gigabyte, HPE, Lenovo, and Supermicro are relying on AI server solutions as important growth dynamics in the global server market amidst the post-pandemic era.
The utilization of chiplets paired with 2.5D and 3D advanced packaging technology is bound to become one of the inevitable development trends of high-end chips in order to allow a continuous elevation of computing performance for chips according to the Moore’s Law. With that being said, the existing micro-bump bonding technology that could impede high-end chips from fully exerting their performance would have to be replaced by hybrid bonding. This report analyzes development trends of chiplet design and advanced packaging technology on the one hand, and probes into the necessity and development momentum of the hybrid bonding technology on future development of high-end chips on the other hand.
1. Overall Performanc
2. R&D Expenses among IC Design Houses
3. Inventory
4. Performance in Other Areas
5. Competition of Smartphone SoC Market
6. TRI’s View