Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

Last Modified

2025-03-13

Update Frequency

Aperiodically

Format

PDF

TrendForce reports AI drives higher NAND Flash transmission performance demands. Samsung, to seize AI edge computing opportunities, accelerates Hybrid Bonding adoption in its V9 (286L) product via YMTC patent authorization. While this technology shrinks die size, increases stack layers, and boosts wafer output, it requires significant Capex for new production lines. Due to NAND Flash oversupply and reduced Capex, Samsung scales down V9 production and postpones mass production to 2026. Short-term, Hybrid Bonding won't generate substantial output or market impact, nor change this year's price forecast. The NAND Flash industry faces the challenge of balancing competitiveness and avoiding oversupply.

＜Total Pages：4＞

Category: Semiconductors , Artificial Intelligence

Spotlight Report

Selected TopicsRelated Reports

AI Wave & DRAM Deficits: 2027 Global DRAM Outlook

2026/07/28

AI/HBM/Server

PDF

Development of China’s Humanoid Robot Industry: Supply Chain Self-Sufficiency and Challenges for Key Components

2026/07/20

Consumer Electronics

PDF

Overcoming the Memory Bottleneck: CXL Expansion and KV Cache Compression Innovations

2026/07/15

Computer System

PDF

Humanoid Robot Industry Diverges: 1H26 Exhibitions Reveal Physical AI's New Competitive Order

2026/07/09

Semiconductors

PDF

SLC NAND Price Surge: Global Capacity Gap & Substitution Wave in 2H 2026

2026/07/06

NAND Flash

PDF

Si-Cap Embedded Packaging Rises for AI: Technical Routes and Competitive Landscape

2026/07/01

Semiconductors

PDF

Download Report

USD

2,000

Membership

Selected Topics New
Selected Topics-TF-0054_Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

Popular Keywords

Research Reports

2,000