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[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

Last Modified

2025-03-13

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Overview

TrendForce reports AI drives higher NAND Flash transmission performance demands. Samsung, to seize AI edge computing opportunities, accelerates Hybrid Bonding adoption in its V9 (286L) product via YMTC patent authorization. While this technology shrinks die size, increases stack layers, and boosts wafer output, it requires significant Capex for new production lines. Due to NAND Flash oversupply and reduced Capex, Samsung scales down V9 production and postpones mass production to 2026. Short-term, Hybrid Bonding won't generate substantial output or market impact, nor change this year's price forecast. The NAND Flash industry faces the challenge of balancing competitiveness and avoiding oversupply.

＜Total Pages：4＞

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[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

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USD $199

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Spotlight Report

[Selected Topics] Updates and Impacts Related to Effects of Trump Administration’s Tariffs on Canada, Mexico, China, and Taiwan

[Selected Topics] The Rise of DeepSeek and Trends in Agentic AI Applications

[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

[Selected Topics] Analysis of the Impact of U.S. Ban on Chinese Automotive Software and Hardware

[Selected Topics] AI Chips to Extricate Smartphone Market from Negative Growth and Gradually Become Market Mainstream

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USD $199

[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

Overview

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[Selected Topics] Updates and Impacts Related to Effects of Trump Administration’s Tariffs on Canada, Mexico, China, and Taiwan

[Selected Topics] The Rise of DeepSeek and Trends in Agentic AI Applications

[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

[Selected Topics] Analysis of the Impact of U.S. Ban on Chinese Automotive Software and Hardware

[Selected Topics] AI Chips to Extricate Smartphone Market from Negative Growth and Gradually Become Market Mainstream

[Selected Topics] Outlook for Network IC Design: Growing Demand for Wi-Fi 7 (Presentation)

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[Selected Topics] NVIDIA Plans to Launch GB300 in 2Q25; GB300 Racks to Ramp Up in 4Q25 as Supply Chain Requires Extra Time on Testing and Qualifications for Higher Specifications

[Selected Topics] Mobile DRAM May See Early Rebound in Contract Prices as Growing Demand of LPDDR5X Ascends Market Sentiment

[Selected Topics] Fueled by AI-Related Applications and CSPs’ Orders, Strong Demand Growth Leads to Upward Revision for Server Market

[Selected Topics] QoQ 8.0% & YoY 84.4% in 4Q24 Server DRAM Revenue under Incessant Demand for DDR5

[Selected Topics] China’s Local Government Subsidies Boost Global Smartphone Production, Driving a QoQ Growth of 9.2% for 4Q24 and Coming to a Total Annual Volume of 1.224 Billion Units

Download Report

USD $199

Membership

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[Selected Topics] AI Chips to Extricate Smartphone Market from Negative Growth and Gradually Become Market Mainstream

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