Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

Last Modified

2025-03-13

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TrendForce reports AI drives higher NAND Flash transmission performance demands. Samsung, to seize AI edge computing opportunities, accelerates Hybrid Bonding adoption in its V9 (286L) product via YMTC patent authorization. While this technology shrinks die size, increases stack layers, and boosts wafer output, it requires significant Capex for new production lines. Due to NAND Flash oversupply and reduced Capex, Samsung scales down V9 production and postpones mass production to 2026. Short-term, Hybrid Bonding won't generate substantial output or market impact, nor change this year's price forecast. The NAND Flash industry faces the challenge of balancing competitiveness and avoiding oversupply.

＜Total Pages：4＞

Category: Artificial Intelligence , Semiconductors

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