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Agentic AI and KV cache offloading as key drivers, analyzing structural shifts in memory demand.
As power delivery bottlenecks extend from the board into the package, explore how MLCCs and silicon capacitors complement each other.
COMPUTEX TAIPEI 2026 centered on Agentic AI, with inference efficiency as the key differentiator. A look back at chip advances from Groq, Taalas, and Cerebras.
LCD stalls. OLED surges 92% YoY in 2025. ASUS dethroned Samsung; Chinese and Korean makers are pivoting capacity as the OLED market battle intensifies.
Apple’s demand sparks an 8.6G AMOLED war! Can China disrupt Korea’s dominance via tech bets and localized supply chains to overtake the market?
AI memory wall is driving HBM and DDR5 demand, sparking a supercycle in 3Q25. Capacity shortages force devices to hike prices or cut specs. When will the cycle end?
Under US restrictions, China is advancing semiconductor equipment self-sufficiency, with EUV as a key bottleneck relative to ASML’s lithography.
Glass-based Micro LED, advanced by Samsung and AUO, benefits from a mature supply chain. LEDoS, still led by JBD, may become the new mainstream once matured.
Ethernet is poised to return as the mainstream in Scale-Out data centers, while InfiniBand stays strong in HPC. Broadcom and NVIDIA are competing for dominance.
ASIC growth may outpace GPU in 2026, putting NVIDIA under pressure. The battle has moved from chip performance to interconnects, switches, software, and ecosystem.
AI is driving data center power use, could double in 5 years! Enterprises face rising costs and ESG pressure. How can they boost efficiency and cut power?
4 major North American CSPs are ramping up investment in AI infrastructure to stay competitive. This article explores AI infra trends through their strategies.
