Semiconductors

AI Server Boom Outpaces U.S. Grid Buildout | TrendForce

New AI Server Boom Outpaces U.S. Grid Buildout

Sep 07, 2026 | PDF

AI servers power surging demand, yet U.S. grid capacity trails shipments as midterm politics raise deferral risk.

2026 3D IC Outlook: SoIC Ramp-Up, Rise of STCO | TrendForce

New 2026 3D IC Outlook: SoIC Ramp-Up, Rise of STCO

Sep 04, 2026 | PDF

In the OCP APAC Summit held in August 2026, suppliers including TSMC, ASE, and AMAT all highlighted the future trends of 3D IC. In September, during SEMICON, the 3DIC Advanced Manufacturing Alliance (...

Kimi K3 Dominates Global Open-Source Models: Core Technologies and the New US-China AI Race | TrendForce

New Kimi K3 Dominates Global Open-Source Models: Core Technologies and the New US-China AI Race

Aug 18, 2026 | PDF

On July 27, 2026, the Chinese AI startup Moonshot AI officially open-sourced the weights for its flagship AI model, Kimi K3. Boasting a total parameter count of 2.8 trillion (2.8T), Kimi K3 currently...

2026 Global IoT Chip Trends: AI Inference Extends to End Devices as Connectivity Diversifies | TrendForce

New 2026 Global IoT Chip Trends: AI Inference Extends to End Devices as Connectivity Diversifies

Aug 07, 2026 | PDF

The market once expected 5G to become the universal connectivity standard for the Internet of Things (IoT) and believed that AI would drive computing power toward the network edge. However, as of 2026...

The Rise of AI Agent Applications Will Drive Demand for Core Semiconductor Components from Edge to Cloud | TrendForce

New The Rise of AI Agent Applications Will Drive Demand for Core Semiconductor Components from Edge to Cloud

Aug 06, 2026 | PDF

This report focuses on the development trends of AI agent applications, revealing how they are changing the existing social landscape, and analyzes the possible shifts in AI core computing hardware co...

2026 Humanoid Robot Market: Dexterous Hand Trends | TrendForce

New 2026 Humanoid Robot Market: Dexterous Hand Trends

Aug 05, 2026 | PDF

Dexterous hands are one of the most costly core modules in humanoid robots. As robot shipments grow, the market for dexterous hands expands in lockstep, and capital is rapidly flowing into specialized...

AI Wave & DRAM Deficits: 2027 Global DRAM Outlook | TrendForce

New AI Wave & DRAM Deficits: 2027 Global DRAM Outlook

Jul 28, 2026 | PDF

Driven by strong demand from cloud service providers, the demand for HBM and server modules has surged. However, constrained by long equipment lead times and capacity reallocation, supply growth conti...

3Q26 Server Market Report | TrendForce

New 3Q26 Server Market Report

Jul 24, 2026 | PDF

Global Server Market – Trends and Outlook for 3Q26

Humanoid Robot Industry Diverges: 1H26 Exhibitions Reveal Physical AI's New Competitive Order | TrendForce

New Humanoid Robot Industry Diverges: 1H26 Exhibitions Reveal Physical AI's New Competitive Order

Jul 09, 2026 | PDF

The global humanoid robotics industry is advancing rapidly across three key hubs—China, North America, and the broader Asian supply chain—and is approaching a pivotal inflection point around 2026 as t...

SLC NAND Price Surge: Global Capacity Gap & Substitution Wave in 2H 2026 | TrendForce

New SLC NAND Price Surge: Global Capacity Gap & Substitution Wave in 2H 2026

Jul 06, 2026 | PDF

As memory giants realign capacity toward high-value advanced processes, mature node capacity faces severe compression. This structural shift has caused severe shortages in legacy chips, compelling ind...

Si-Cap Embedded Packaging Rises for AI: Technical Routes and Competitive Landscape | TrendForce

New Si-Cap Embedded Packaging Rises for AI: Technical Routes and Competitive Landscape

Jul 01, 2026 | PDF

As AI chips require increasingly stable power delivery, Si‑Cap (silicon capacitors) and their embedded/integrated packaging have become an important technological development direction, and key compan...

Key AI Components – Fiberglass Cloth | TrendForce

New Key AI Components – Fiberglass Cloth

Jun 26, 2026 | PDF

The surge in demand for AI chips and high-speed servers is driving the demand for high-end fiberglass cloth. However, constrained by technical barriers, equipment bottlenecks, and yield challenges, th...

2026 China AI Chip Industry: Opportunities and Challenges for Domestic Substitution Amid Geopolitical Risk | TrendForce

New 2026 China AI Chip Industry: Opportunities and Challenges for Domestic Substitution Amid Geopolitical Risk

Jun 26, 2026 | PDF

The AI industry entered a critical transition period in 2025, marked by the rapid expansion of LLMs and the large-scale commercialization of AI applications. For China’s semiconductor industry, this r...

2026 Outlook: Global Semiconductor Supply Chain Diversification and Materials Strategy | TrendForce

New 2026 Outlook: Global Semiconductor Supply Chain Diversification and Materials Strategy

Jun 18, 2026 | PDF

Global semiconductor supply chains are shifting from efficiency to resilience amid escalating export controls, driving manufacturing diversification. Governments race to subsidize domestic ecosystems,...

Cascading Shortages in Consumer DRAM: How Capacity Pivots Fuel Legacy Node Adoption | TrendForce

Cascading Shortages in Consumer DRAM: How Capacity Pivots Fuel Legacy Node Adoption

Jun 17, 2026 | PDF

Driven by AI infrastructure, major DRAM makers shift capacity to advanced nodes, tightening mature processes. To secure supply and control costs, brands downgrade to older generation consumer DRAM, sh...

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