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Values of AI servers and corresponding computing cores GPGPU (General-Purpose Computing on Graphics Processing Unit) in parallel computing as LLM (Large Language Model), which excels in NLP (Natural L...
The utilization of chiplets paired with 2.5D and 3D advanced packaging technology is bound to become one of the inevitable development trends of high-end chips in order to allow a continuous elevation...
1. Overall Performanc 2. R&D Expenses among IC Design Houses 3. Inventory 4. Performance in Other Areas 5. Competition of Smartphone SoC Market 6. TRI’s View
Components adopted with InP, a compound semiconductor material, are higher in drift velocity for saturation electrons, stronger in radiation resistance, better in thermal conductivity, higher in photo...
GaN, with its superior properties such as high breakdown field strength, high saturation electron drift velocity, strong radiation resistance, and good chemical stability, enables the manufacture of o...
The demand for large-size display driver ICs in 2023 is set to increase seasonally with panel demand. However, due to conservative stockpiling by the supply chain, a potential shortage could surface i...
Wafer manufacturing involves the use of various semiconductor equipment that can be categorized into more than ten types, such as photolithography machines, etching equipment, and thin-film deposition...
