Semiconductors

Chinese Companies Benefit from Mature Process Chips, EDA Becomes Focus in Pursuit of Self-Sufficiency | TrendForce

Chinese Companies Benefit from Mature Process Chips, EDA Becomes Focus in Pursuit of Self-Sufficiency

Aug 12, 2024 | PDF

This report explores the impact of US semiconductor export controls on China’s semiconductor industry and analyzes why Chinese manufacturers have more room to maneuver in the mature process segment. T...

The Development of the Semiconductor Industry and Geopolitical Strategies in the Age of AI (Presentation) | TrendForce

The Development of the Semiconductor Industry and Geopolitical Strategies in the Age of AI (Presentation)

Aug 02, 2024 | PDF

1. An Overview of the Semiconductor Market 2. Demand & Capacity Utilization 3. Supply & Geopolitical Impact 4. The Semiconductor Market in the Age of AI 5. TRI’s View

New Era for Japanese Semiconductor Industry: Innovations and Development Trends under Governmental Interventions (Presentation) | TrendForce

New Era for Japanese Semiconductor Industry: Innovations and Development Trends under Governmental Interventions (Presentation)

Jul 09, 2024 | PDF

1. New Era for Japanese Semiconductor Industry: Innovations and Development Trends under Governmental Interventions 2. TRI's View

AMD and NVIDIA Take the Lead in Transitioning to FOPLP for PC CPU, PMIC, and AI GPU to Reduce Cost and Expand Packaging Sizes of Large-Sized Chips | TrendForce

AMD and NVIDIA Take the Lead in Transitioning to FOPLP for PC CPU, PMIC, and AI GPU to Reduce Cost and Expand Packaging Sizes of Large-Sized Chips

Jun 27, 2024 | PDF

As indicated by the survey of global market intelligence firm TrendForce, chip suppliers such as AMD have been actively involved in negotiations with TSMC and OSAT throughout 2Q24 on chip packaging us...

LPO, OBO, and CPO Put to Test as Optical Modules Encounter Bottlenecks | TrendForce

LPO, OBO, and CPO Put to Test as Optical Modules Encounter Bottlenecks

Jun 14, 2024 | PDF

Optical module is an indispensable component for achieving optical communication. However, corresponding issues are becoming increasingly apparent alongside the continuously climbing usage and growing...

From 2.5D to 3D: Key Processes of Hybrid Bonding and Strategies of Equipment Providers | TrendForce

From 2.5D to 3D: Key Processes of Hybrid Bonding and Strategies of Equipment Providers

Jun 05, 2024 | PDF

Under the influence of growing AI-related demand and the slowing pace of node migration under Moore’s Law, achieving lower power consumption and higher transistor counts on a single chip has become a...

A Glimpse into the Adoption Challenges and Technological Planning of TSMC’s 3nm Technology from the TSMC Techonology Synposium | TrendForce

A Glimpse into the Adoption Challenges and Technological Planning of TSMC’s 3nm Technology from the TSMC Techonology Synposium

May 10, 2024 | PDF

TSMC president C.C. Wei was questioned by analysts about the potential introduction of High-NA EUV during TSMC’s 4Q23 earnings call. He responded, “Because of technology itself is no value. Only when...

Global Trends in Cloud AI Chip Industry  (Presentation) | TrendForce

Global Trends in Cloud AI Chip Industry (Presentation)

May 08, 2024 | PDF

1. Status-quo of the Cloud AI Chip Market 2. Developments of Cloud AI Chipmakers Worldwide 3. Developments of CSPs’ Self-designed AI Chips 4. TRI’s View

Analysis on Development Dynamics of Global FPGA Market | TrendForce

Analysis on Development Dynamics of Global FPGA Market

May 03, 2024 | PDF

FPGAs have diverse functions and are widely used in various fields, and is increasing in importance with the continuous advancement of electronic devices. This report mainly analyzes the product chara...

Dynamic of Taiwan's Cloud AI IC Design Industry (Presentation) | TrendForce

Dynamic of Taiwan's Cloud AI IC Design Industry (Presentation)

Apr 19, 2024 | PDF

1. Market Status of Cloud AI Chips 2. AI ASIC Suppliers 3. IC Design Service Providers 4. Memory IP Providers 5. TRI’s View

Follow-Up and Analysis on Apple’s Supply Chain Shift | TrendForce

Follow-Up and Analysis on Apple’s Supply Chain Shift

Apr 16, 2024 | PDF

As international geopolitical risks rise, Apple is beginning to face the issue of supply chain relocation. Since 2000, Apple has established a complete supply chain layout in China. Before the outbrea...

Trends in Global Silicon Photonics Industry | TrendForce

Trends in Global Silicon Photonics Industry

Apr 12, 2024 | PDF

Silicon photonics, which emerges from the synthesis of silicon-based integrated circuits and semiconductor lasers, plays a pivotal role in advancing semiconductor technologies. This report aims to ana...

2024 Analysis of Supply and Demand for Panel Driver ICs | TrendForce

2024 Analysis of Supply and Demand for Panel Driver ICs

Apr 11, 2024 | PDF

Demand for large panel driver ICs is set to rise sequentially throughout 2024, with ample overall supply. However, uncertainty in end-user demand has led to conservative stocking practices in the supp...

Recent Developments in the Industry for Automotive Main Control Chips (Presentation) | TrendForce

Recent Developments in the Industry for Automotive Main Control Chips (Presentation)

Mar 15, 2024 | PDF

1. Different Types of Automotive Main Control Chips 2. MCU 3. Cockpit SoC 4. Autonomous Driving SoC 5. TRI’s View

Rise of Silicon Photonics and CPO Technology Innovating Light Communication Solutions | TrendForce

Rise of Silicon Photonics and CPO Technology Innovating Light Communication Solutions

Mar 04, 2024 | PDF

As global internet data transmission volume continues to reach new highs, the performance bottleneck of light communication solutions becomes increasingly apparent. This report, on the one hand, explo...

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