Download Report
Contact Us
Research Reports
[Selected Topics] AMD and NVIDIA Take the Lead in Transitioning to FOPLP for PC CPU, PMIC, and AI GPU to Reduce Cost and Expand Packaging Sizes of Large-Sized Chips
Last Modified
2024-06-27
Update Frequency
Not
Format
Overview
Summary
As indicated by the survey of global market intelligence firm TrendForce, chip suppliers such as AMD have been actively involved in negotiations with TSMC and OSAT throughout 2Q24 on chip packaging using the FOPLP technology, with major partnership models and items shown below:
Model 1: OSATs transitioning from traditional packaging method to FOPLP when packaging consumer ICs: AMD is currently negotiating with PTI and ASE on PC CPUs, whereas Qualcomm is talking it over with ASE on PMIC. Prior to this wave of demand, MediaTek had been worked with PTI on PMIC, while Qualcomm was already a partner of ASE pertaining to PMIC.
Model 2: foundries and OSATs transitioning from 2.5D wafer level to panel level when packaging AI GPUs: AMD and NVIDIA are currently negotiating with TSMC and SPIL on packaging AI GPUs by switching from the existing 2.5D wafer level to panel level, followed by an expansion in chip packaging sizes.
Model 3: panel providers packaging consumer ICs: NXP and STMicroelectronics are negotiating with Innolux on PMIC products.
＜Total Pages：8＞
Spotlight Report
-
[Selected Topics] 2024 Analysis of Supply and Demand for Panel Driver ICs
2024/04/11
Selected Topics
PDF
-
[Selected Topics] AI Applications: 5G Base Stations
2024/06/21
Selected Topics
PDF
-
[Selected Topics] Mobile Memory and Smartphone Market: 2023 Review and 2024 Outlook
2024/05/17
Selected Topics
PDF
-
[Selected Topics] A Glimpse into the Adoption Challenges and Technological Planning of TSMC’s 3nm Technology from the TSMC Techonology Synposium
2024/05/10
Selected Topics
PDF
-
[Selected Topics] FOPLP to Accommodate Different Types of Suppliers with Market Segmentation
2024/09/04
Selected Topics
PDF
-
[Selected Topics] Electrification and Intelligence in the Automotive Industry Drive Strong Growth for Automotive Sensors
2024/06/28
Selected Topics
PDF
Selected TopicsRelated Reports
Download Report
USD $200
Membership
Spotlight Report
-
[Selected Topics] 2024 Analysis of Supply and Demand for Panel Driver ICs
2024/04/11
Selected Topics
PDF
-
[Selected Topics] AI Applications: 5G Base Stations
2024/06/21
Selected Topics
PDF
-
[Selected Topics] Mobile Memory and Smartphone Market: 2023 Review and 2024 Outlook
2024/05/17
Selected Topics
PDF
-
[Selected Topics] A Glimpse into the Adoption Challenges and Technological Planning of TSMC’s 3nm Technology from the TSMC Techonology Synposium
2024/05/10
Selected Topics
PDF
-
[Selected Topics] FOPLP to Accommodate Different Types of Suppliers with Market Segmentation
2024/09/04
Selected Topics
PDF
-
[Selected Topics] Electrification and Intelligence in the Automotive Industry Drive Strong Growth for Automotive Sensors
2024/06/28
Selected Topics
PDF