AMD and NVIDIA Take the Lead in Transitioning to FOPLP for PC CPU, PMIC, and AI GPU to Reduce Cost and Expand Packaging Sizes of Large-Sized Chips

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2024-06-27

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Summary

As indicated by the survey of global market intelligence firm TrendForce, chip suppliers such as AMD have been actively involved in negotiations with TSMC and OSAT throughout 2Q24 on chip packaging using the FOPLP technology, with major partnership models and items shown below:

Model 1: OSATs transitioning from traditional packaging method to FOPLP when packaging consumer ICs: AMD is currently negotiating with PTI and ASE on PC CPUs, whereas Qualcomm is talking it over with ASE on PMIC. Prior to this wave of demand, MediaTek had been worked with PTI on PMIC, while Qualcomm was already a partner of ASE pertaining to PMIC.

Model 2: foundries and OSATs transitioning from 2.5D wafer level to panel level when packaging AI GPUs: AMD and NVIDIA are currently negotiating with TSMC and SPIL on packaging AI GPUs by switching from the existing 2.5D wafer level to panel level, followed by an expansion in chip packaging sizes.

Model 3: panel providers packaging consumer ICs: NXP and STMicroelectronics are negotiating with Innolux on PMIC products.

＜Total Pages：8＞

Sector: Semiconductor Device IC Testing & Packaging Semiconductors Computer System

Tag: AI Chip FOPLP OSAT Advanced Packaging Competitive Landscape Supply Chain Technology Roadmap TSMC NVIDIA AMD SPIL STMicroelectronics Innolux NXP

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