Events

TrendForce presents a comprehensive analysis of this evolving landscape. We will examine the strategic shifts shaping the foundry market, the accelerating demand for DRAM and HBM driven by AI infrastructure, and the emerging role of LPDRAM in next-generation computing applications. Join TrendForce analysts to gain insights into the market dynamics, technology trends, and competitive forces defining the next wave of semiconductor innovation.

Rapid advancements in artificial intelligence are driving an unprecedented compute revolution. This forum brings together leading experts to explore the critical pillars of this transition, focusing on advanced foundry manufacturing and next-generation AI server deployment. Understanding how cutting-edge silicon fabrication and system-level integration interconnect is key to navigating the future of global AI infrastructure.

Hosted by TrendForce during SEMICON Taiwan week on September 3, 2026, at Humble House Taipei, this executive briefing explores key market dynamics across the AI ecosystem. Leading analysts will share insider insights on US and China hyperscaler datacenters, the 2026–2027 AI capex cycle, semiconductor processing equipment (SPE), and the MLCC market outlook, offering high-level executive networking and actionable supply chain intelligence.