Events

As AI computing power demand skyrockets, the energy consumption of next-gen GPU chips is surging, pushing AI infrastructure to its physical heat limits. To tackle this challenge, AI systems are shifting from traditional air cooling to the more advanced liquid cooling, and from electrical transmission to cutting-edge optical transmission. This marks an exciting and crucial period of innovation!

世界的なAIブームの中、半導体はAI・HPC・5G・電気自動車を支える重要な基盤となっています。 各国が産業戦略を加速させる中、サプライチェーンの協力とイノベーションは新たな段階へ。 台湾はファウンドリー、DRAM、HBMで強みを発揮し、日本は材料・製造装置・先端パッケージでリードしています。 台日が連携することで、強靭性を高め、新しいアプリケーションの可能性が広がります。 本セミナーではDRAM、HBM、ファウンドリー、IC設計に焦点を当て、最新の産業動向を徹底解説します！

AI has moved beyond trend status—it is now the central force accelerating a new wave of electronics innovation, fueling progress from near-eye displays and autonomous robotics to HBM memory, advanced MLCCs, and AI-optimized semiconductor manufacturing. As the global tech sector enters a phase of structural transformation, the convergence of AI, rising performance demands, and manufacturing complexity is reshaping every layer of the electronics value chain. In response to shifting market dynamics, companies are rethinking materials science, packaging architectures, fabless-foundry collaboration, and end-to-end supply chain strategies. TrendForce Roadshow Korea presents a holistic analysis grounded in the dynamics of the full electronics value chain. Backed by our in-house analysts' insights, this event highlights how emerging technologies are reshaping industry structures and where momentum is building across an AI-native future.