Events

Rapid advancements in artificial intelligence are driving an unprecedented compute revolution. This forum brings together leading experts to explore the critical pillars of this transition, focusing on advanced foundry manufacturing and next-generation AI server deployment. Understanding how cutting-edge silicon fabrication and system-level integration interconnect is key to navigating the future of global AI infrastructure.

Hosted by TrendForce during SEMICON Taiwan week on September 3, 2026, at Humble House Taipei, this executive briefing explores key market dynamics across the AI ecosystem. Leading analysts will share insider insights on US and China hyperscaler datacenters, the 2026–2027 AI capex cycle, semiconductor processing equipment (SPE), and the MLCC market outlook, offering high-level executive networking and actionable supply chain intelligence.

As AI moves toward accelerated expansion in 2026, this seminar explores deep industrial shifts across memory and foundry. Key topics include the structural capacity gap in DRAM/NAND, the strategic dominance of HBM, the dual realities of the foundry market, and the diversification of AI servers. This session provides critical insights for navigating the 2026–2028 supercycle and capturing emerging market opportunities.