Events

TrendForce Roadshow Korea - AI Semiconductor Underpinnings Across Foundry and Memory

TrendForce presents a comprehensive analysis of this evolving landscape. We will examine the strategic shifts shaping the foundry market, the accelerating demand for DRAM and HBM driven by AI infrastructure, and the emerging role of LPDRAM in next-generation computing applications. Join TrendForce analysts to gain insights into the market dynamics, technology trends, and competitive forces defining the next wave of semiconductor innovation.

TrendForce Roadshow San Francisco - AI Compute Revolution From Foundries to Next-Gen Servers

Rapid advancements in artificial intelligence are driving an unprecedented compute revolution. This forum brings together leading experts to explore the critical pillars of this transition, focusing on advanced foundry manufacturing and next-generation AI server deployment. Understanding how cutting-edge silicon fabrication and system-level integration interconnect is key to navigating the future of global AI infrastructure.

TrendForce Roadshow Taipei- Navigating the AI Supply Chain

Hosted by TrendForce during SEMICON Taiwan week on September 3, 2026, at Humble House Taipei, this executive briefing explores key market dynamics across the AI ecosystem. Leading analysts will share insider insights on US and China hyperscaler datacenters, the 2026–2027 AI capex cycle, semiconductor processing equipment (SPE), and the MLCC market outlook, offering high-level executive networking and actionable supply chain intelligence.

TrendForce Roadshow New York - Integrated AI Dynamics Across Memory and Foundry

As AI moves toward accelerated expansion in 2026, this seminar explores deep industrial shifts across memory and foundry. Key topics include the structural capacity gap in DRAM/NAND, the strategic dominance of HBM, the dual realities of the foundry market, and the diversification of AI servers. This session provides critical insights for navigating the 2026–2028 supercycle and capturing emerging market opportunities.

TrendForce Roadshow Korea 2026 - Next-Wave Display Insights

Future Computing Power Unlocked by AI Infra

As AI computing power demand skyrockets, the energy consumption of next-gen GPU chips is surging, pushing AI infrastructure to its physical heat limits. To tackle this challenge, AI systems are shifting from traditional air cooling to the more advanced liquid cooling, and from electrical transmission to cutting-edge optical transmission. This marks an exciting and crucial period of innovation!