Events

TrendForce Roadshow New York - Integrated AI Dynamics Across Memory and Foundry

As AI moves toward accelerated expansion in 2026, this seminar explores deep industrial shifts across memory and foundry. Key topics include the structural capacity gap in DRAM/NAND, the strategic dominance of HBM, the dual realities of the foundry market, and the diversification of AI servers. This session provides critical insights for navigating the 2026–2028 supercycle and capturing emerging market opportunities.

TrendForce Roadshow Korea 2026 - Next-Wave Display Insights

Future Computing Power Unlocked by AI Infra

As AI computing power demand skyrockets, the energy consumption of next-gen GPU chips is surging, pushing AI infrastructure to its physical heat limits. To tackle this challenge, AI systems are shifting from traditional air cooling to the more advanced liquid cooling, and from electrical transmission to cutting-edge optical transmission. This marks an exciting and crucial period of innovation!