Server and AI demand keep foundry utilization high in 2027; tight 8-inch supply, 12-inch expansion and price hikes lift output value to a record.
AI and flagship phones lift TSMC's 3nm and 2nm, while tight mature-node capacity supports pricing; foundries expand for growth.
Strong AI data center demand is driving growth through the twin engines of AI chips and memory. Memory shortages and price hikes have pushed memory’s share of industry revenue to a record high and rai...
This provides a comprehensive Global IC & Semi market analysis, including various application and product types, as well as a forecast on the situation of IC &a...
This includes a comprehensive market update on Global and China region, extending the market landscape and market size further into specific region along with the long-term forecast.
Samsung speeds 8-inch cuts, plans 2027 hikes; AI demand lifts mature nodes as SMIC, Nexchip, HuaHong raise prices, expand.
AI and advanced nodes are driving a paradigm shift in process control. Although GAA, HBM, and advanced packaging follow different paths, all share one logic: testing costs far less than failure. This...
Inference demand drives CSP ASIC growth past GPUs; Google's next TPU adopts EMIB-T, with substrate yield key to cost.
Tight 8-inch supply fuels foundry price hikes, as TSMC and peers pivot mature capacity to advanced packaging and SiPh.
The Diamond reports cover major foundries such as TSMC, UMC, Samsung, SMIC, and GlobalFoundries, etc. The Diamond reports provide extended analyses of these foundries&a...
Non-TSMC foundries head into 2027 with higher utilization, price hikes, and sustained strong revenue growth.
Taiwan foundries see a strong 2027 as utilization rises, capacity expands, and prices climb across the board.
AI peripheral demand drove advanced nodes and spilled into mature nodes, while consumer restocking continued, lifting 2Q26 revenue to a new high. Top five stayed stable; VIS rose on stronger demand, r...
In the OCP APAC Summit held in August 2026, suppliers including TSMC, ASE, and AMAT all highlighted the future trends of 3D IC. In September, during SEMICON, the 3DIC Advanced Manufacturing Alliance (...
A Vanguard Fab3 rooftop fire spared the cleanroom; output resumed, CMP is recovering, revenue impact stays limited.
