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CSP ASICs Rise as Google TPU Eyes EMIB Packaging

Last Modified

2026-10-13

Update Frequency

Aperiodically

Format

PDF

Inference demand drives CSP ASIC growth past GPUs; Google's next TPU adopts EMIB-T, with substrate yield key to cost.

Key Highlights

ASIC Share Climbs: Google-led CSP ASICs outgrow GPU servers.
Inference Focus: Efficiency and cost push CSPs to in-house chips.
Multi-Vendor TPU: Google adds MediaTek and Marvell beside Broadcom.
EMIB-T Hurdle: Substrate yield decides TPU v9 cost edge over CoWoS.

Table of Contents

Growth of CSPs’ In-House AI ASICs Will Outpace That of GPUs; ASIC Servers’ Share in AI Server Shipments Expected to Climb Further by 2027
- Shipment Share of ASIC AI Servers, 2025-2027F
Focus on Efficiency, Latency, and ROI in AI Inference Drives CSPs’ Investments in Proprietary ASICs; Multi-Vendor Strategies Have Also Been Adopted to Maximize Efficiency in Chip R&D
- Broadcom and MediaTek Have Been Google’s Key Partners for the Development of TPUs in Recent Years
Google TPU v9 to Adopt Intel’s EMIB-T Packaging, though Substrate Yield in 2027 Would Become Key for Mass Production of Chips
Analysis on Yield and Overall Cost Efficacy of CoWoS and EMIB

<Total Pages: 7>

Shipment Share of ASIC AI Servers, 2025-2027F

Sector: AI Server / Data Center Memory & Storage Wafer Fabrication / Foundry

Tag: HBM CoWoS Liquid Cooling Enterprise SSD ASIC AI Chip AI Accelerator Server Memory GDDR QLC NAND AI Storage AI Inference AI Server AI Training Advanced Node Server Advanced Packaging HBM3 HBM4 Server GPU AI Capex ASP Capacity Utilization Rate CapEx Competitive Landscape CSP Market Bulletin Market Share Market Size Penetration Rate Pricing Trends Production Capacity Revenue Shipments Supply Chain Supply & Demand Technology Roadmap Wafer Price Industry Datasheet

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