AI and advanced nodes are driving a paradigm shift in process control. Although GAA, HBM, and advanced packaging follow different paths, all share one logic: testing costs far less than failure. This...
Inference demand drives CSP ASIC growth past GPUs; Google's next TPU adopts EMIB-T, with substrate yield key to cost.
Hyperscaler Capex keeps rising on price hikes and shortages; pricier AI racks drive server value growth over volume.
US hyperscalers keep expanding, but midterm-driven backlash may raise costs and delay permits for later-stage projects.
Suppliers and CSPs have signed multi-year server DRAM LTAs, placing many of its bit supply under price-band mechanisms while the rest are negotiated quarterly; spot trading remains quiet and flat. Mic...
Micron's strong results and upbeat outlook show AI data centers, edge AI and physical AI driving high-capacity storage demand, with data center SSDs as NAND's core profit engine. Dis...
Tight 8-inch supply fuels foundry price hikes, as TSMC and peers pivot mature capacity to advanced packaging and SiPh.
AI chip and server growth accelerates in 2027 on rack-scale systems and ASICs, while HBM and CoWoS supply stays tight.
The Diamond reports cover major foundries such as TSMC, UMC, Samsung, SMIC, and GlobalFoundries, etc. The Diamond reports provide extended analyses of these foundries&a...
CapEx figures, production capacity figures, and inventory levels of MLCC suppliers are constantly being tracked and updated on a regular basis. TrendForce also provides analyses on the price trends an...
Tight supply and robust CSP demand keep DRAM undersupplied; TrendForce lifts its 4Q26 contract price outlook.
Driven by AGI and Agent AI, North American cloud providers' urgent orders for enterprise SSDs created a structural shortage in high-end storage. Suppliers prioritized capacity for high-margin pro...
SEMICON Taiwan & CIOE 2026 exhibit report includes infrared sensing, UV disinfection and sensing, and optical communications.
NVIDIA shipments stay Blackwell-led as Rubin's ramp slips into next year on HBM4 snags, keeping HBM the key bottleneck.
AI chip makers weigh downgrading HBM capacity, hitting capacity for KV cache, lifting offload memory demand, as 8hi stays mainstream.
