AI chipmakers are adopting custom HBM as base dies move to advanced logic nodes, strengthening TSMC's role in the HBM supply chain.
Hybrid Bonding is set to become a long-term DRAM trend, driven by scaling and bandwidth requirement, though timing depends on yield and cost.
Fourth-quarter contract price hikes are set to narrow as spot prices stay range-bound, while hybrid bonding replaces layer stacking as the key to NAND speed and cost.
Samsung speeds 8-inch cuts, plans 2027 hikes; AI demand lifts mature nodes as SMIC, Nexchip, HuaHong raise prices, expand.
With our expertise in the memory market, this provides a comprehensive analysis and forecast on HBM market share, ASP, wafer capacity, demand consumption, etc.
Agentic AI and inference reshape workloads, lifting server CPU demand. Shipments surge as CSP in-house Arm CPUs erode x86 share.
AI and advanced nodes are driving a paradigm shift in process control. Although GAA, HBM, and advanced packaging follow different paths, all share one logic: testing costs far less than failure. This...
Inference demand drives CSP ASIC growth past GPUs; Google's next TPU adopts EMIB-T, with substrate yield key to cost.
Hyperscaler Capex keeps rising on price hikes and shortages; pricier AI racks drive server value growth over volume.
US hyperscalers keep expanding, but midterm-driven backlash may raise costs and delay permits for later-stage projects.
Suppliers and CSPs have signed multi-year server DRAM LTAs, placing many of its bit supply under price-band mechanisms while the rest are negotiated quarterly; spot trading remains quiet and flat. Mic...
Micron's strong results and upbeat outlook show AI data centers, edge AI and physical AI driving high-capacity storage demand, with data center SSDs as NAND's core profit engine. Dis...
Tight 8-inch supply fuels foundry price hikes, as TSMC and peers pivot mature capacity to advanced packaging and SiPh.
AI chip and server growth accelerates in 2027 on rack-scale systems and ASICs, while HBM and CoWoS supply stays tight.
The Diamond reports cover major foundries such as TSMC, UMC, Samsung, SMIC, and GlobalFoundries, etc. The Diamond reports provide extended analyses of these foundries&a...
