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Foundry Market Bulletin - Oct. 5, 2026
Last Modified
2026-10-05
Update Frequency
Biweekly
Format
Tight 8-inch supply fuels foundry price hikes, as TSMC and peers pivot mature capacity to advanced packaging and SiPh.
Key Highlights
- TSMC: Delays mature-node exit; shifts capacity to CoWoS interposer and SiPh.
- UMC: Near-full 8-inch finer-geometry fabs back hikes; 12-inch talks pending.
- Vanguard: Signals price hikes; AI power first, less capacity for Qualcomm.
- PSMC: Seeks SiPh IP license; keeps some HV for OOC.
Table of Contents
- TSMC
- UMC
- Vanguard
- PSMC
- Changes to Qualcomm's Demand and Foundry Partnerships for 2027
<Total Pages: 3>
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