With our expertise in the memory market, this provides a comprehensive analysis and forecast on HBM market share, ASP, wafer capacity, demand consumption, etc.
TrendForce has raised the capex forecast for major US and Chinese CSPs. With memory contract prices remaining elevated, memory spending is set to exceed half of total capex, while suppliers are priori...
Agentic AI and inference reshape workloads, lifting server CPU demand. Shipments surge as CSP in-house Arm CPUs erode x86 share.
AI and advanced nodes are driving a paradigm shift in process control. Although GAA, HBM, and advanced packaging follow different paths, all share one logic: testing costs far less than failure. This...
Inference demand drives CSP ASIC growth past GPUs; Google's next TPU adopts EMIB-T, with substrate yield key to cost.
Market Flash is a dedicated membership program that provides clients with access to special reports on display-related markets, offering timely insights and exclusive research updates through a secure...
Hyperscaler Capex keeps rising on price hikes and shortages; pricier AI racks drive server value growth over volume.
Boston Dynamics is choosing a lean, task-driven hand designed with mass production in mind, while Tesla's pursuit of near-human dexterity has made manufacturing its toughest bottleneck, a split t...
US hyperscalers keep expanding, but midterm-driven backlash may raise costs and delay permits for later-stage projects.
Toshiba is significantly expanding its HDD capacity in the Philippines, but given the lead time from investment to output, the benefits will materialize later, adding supply to the market without resh...
Suppliers and CSPs have signed multi-year server DRAM LTAs, placing many of its bit supply under price-band mechanisms while the rest are negotiated quarterly; spot trading remains quiet and flat. Mic...
Micron's strong results and upbeat outlook show AI data centers, edge AI and physical AI driving high-capacity storage demand, with data center SSDs as NAND's core profit engine. Dis...
Tight 8-inch supply fuels foundry price hikes, as TSMC and peers pivot mature capacity to advanced packaging and SiPh.
AI chip and server growth accelerates in 2027 on rack-scale systems and ASICs, while HBM and CoWoS supply stays tight.
The Diamond reports cover major foundries such as TSMC, UMC, Samsung, SMIC, and GlobalFoundries, etc. The Diamond reports provide extended analyses of these foundries&a...
