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DRAM Market Bulletin - Oct. 21, 2026

Last Modified

2026-10-21

Update Frequency

Weekly

Format

PDF

Hybrid Bonding is set to become a long-term DRAM trend, driven by scaling and bandwidth requirement, though timing depends on yield and cost.

Key Highlights

PC DRAM supply is set to contract next year, and vendors are aggressively widening price hikes in fourth-quarter contract quotes.
The spot market is split, with DDR5 hard to source amid tight supply and suppliers reluctant to sell.
Hybrid Bonding shrinks die size in conventional DRAM and will be adopted in future generations, while Wide I/O Memory adoption will start with Edge AI applications.
HBM stacks are converging toward lower layers, which pushes 16hi volume production later, and further progress will depend on yield and cost.

Table of Contents

Market Update
TrendForce’s View
- Wide I/O Memory Architecture
- 8hi HBM to Become Mainstream in 2H27

<Total Pages: 3>

Wide I/O Memory Architecture

Sector: Memory & Storage

Tag: DRAM Contract Price Market Bulletin Production Capacity Revenue Spot Price Supply & Demand Technology Trends

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