Custom HBM Rises as Advanced Base Dies Elevate TSMC

Last Modified

2026-10-22

Update Frequency

Aperiodically

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AI chipmakers are adopting custom HBM as base dies move to advanced logic nodes, strengthening TSMC's role in the HBM supply chain.

Key Highlights

cHBM Rise: Standard HBM struggles to optimize for each AI chip, driving customization.
Base Die Shift: Adopt Logic process and Integrate new functions.
NVHBM Plan: Relied on TSMC's process, ramping with AI chips.
Node Migration: From HBM4e, base dies go fully logic, lifting advanced node demand.
TSMC Role: Process lead and ecosystem make it the main foundry; competition shifts to integration.

Introduction
- Comparison of sHBM’s and cHBM’s Base Die Structures
The NVHBM Base Die Will Primarily Adopt TSMC’s 3nm FinFET Process
The Trend of Customizing HBM Will Drive Demand for Advanced Process Capacity Starting in 2028
- Overview of Base Die Process Nodes and Foundry Sourcing Across Major HBM Suppliers

Overview of Base Die Process Nodes and Foundry Sourcing Across Major HBM Suppliers