AI Server Industry Analysis-3Q26
Last Modified
2026-10-02
Update Frequency
Quarterly
Format
AI chip and server growth accelerates in 2027 on rack-scale systems and ASICs, while HBM and CoWoS supply stays tight.
Key Highlights
- AI Chips: Rubin, MI450 and TPU fuel growth.
- AI Servers: Racks and CSP capex lift output; ASICs gain.
- HBM: Demand nears supply; Samsung gains with HBM4.
- Cooling & SSD: Liquid cooling and QLC SSDs rise.
- Packaging: CoWoS stays tight; orders spill to OSATs.
Table of Contents
- Analysis of the Market for Mainstream AI Chips
- Overview of the World’s Major AI Chip Suppliers and Their Offerings
- Shipment Shares of High-End and Midrange-to-Low-End AI Chips, 2025-2027F
- Analysis on Dynamics of AI Server Market
- Dynamics of Global Market for AI Servers
- Projected YoY Growth Rate for 2027 AI Server Shipments Revised Upward
- Analysis of AI Server Shipments by Major AI Chip Category
- Shipment Share of ASIC-Based AI Servers Will Continue to Rise in 2027
- Projected Changes to Distribution of Major AI Server Suppliers
- Ratio of Others among CSPs' ASICs to Expand Further in 2027
- Trends in the AI Server Cooling Market
- Overall Penetration Rate of Liquid-Cooling among AI Chips to Rise Further in 2027
- Outlook on AI Enterprise SSD Market
- Projections on Demand for AI Servers and HBM
- Demand Bit for HBM from AI to Continue to Rise throughout 2026
- Analysis on Supply of HBM for AI Servers
- Projected Changes to Prices of HBM Mostly Adopted by AI Servers
- Key Observations on Dynamics of AI Server Industry
- Projected Distribution of Demand for CoWoS among TSMC and Major OSATs
<Total Pages: 16>
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