AI Server Industry Analysis-2Q26
Last Modified
2026-07-03
Update Frequency
Aperiodically
Format
AI chip demand surges in 2026, with high-end GPUs dominating. NVIDIA leads, ASICs gain share, liquid cooling expands, and AI server value hits record highs.
Key Highlights
- Market Scale: AI server shipments approach 2.8M units in 2026, with YoY growth near 30.5%; total server output value exceeds 624B USD, with AI servers accounting for over 74%.
- Chip Dynamics: NVIDIA raises its high-end GPU target on strong Blackwell demand; AMD trims estimates as MI450 ramp delays; Google TPU and China's Huawei and Cambricon post solid growth.
- Liquid Cooling: High-end AI chip liquid cooling penetration rises from 41% in 2025 to 65%; overall AI chip rate reaches 53%, driven by NVIDIA and Google ASIC platforms.
- HBM Supply: HBM demand more than doubles in 2026; HBM3e dominates while HBM4 ramp delays; SK Hynix retains top supplier position, with 2027 pricing expected to surge sharply.
Table of Contents
- Analysis of the Market for Mainstream AI Chips
- Overview of the World’s Major AI Chip Suppliers and Their Offerings
- High-End AI Chips Projected to Remain the Dominant Shipment Share in 2026
- Analysis on Dynamics of AI Server Market
- Dynamics of Global Market for AI Servers
- AI Server Shipment to Continue Climbing YoY in 2026
- Analysis of AI Server Shipments by Major AI Chip Category
- Market Share of Products Featuring ASICs to Return to Growth in 2026
- Projected Changes to Distribution of Major AI Server Suppliers
- Ratio of Others among CSPs' ASICs Set for Shift in 2026
- Trends in the AI Server Cooling Market
- Overall Penetration Rate of Liquid-Cooling among AI Chips to Continue Rising in 2026
- Outlook on AI Enterprise Market
- Projections on Demand for AI Servers and HBM
- Demand Bit for HBM from AI to Continue to Rise throughout 2026
- Analysis on Supply of HBM for AI Servers
- Projected Changes to Prices of HBM Mostly Adopted by AI Servers
- Key Observations on Dynamics of AI Server Industry
- Projected Distribution of Demand for TSMC’s CoWoS Capacity among Major Clients
<Total Pages: 16>
Sector: AI Server / Data Center Memory & Storage Semiconductor Device
Tag: HBM CoWoS NVIDIA Blackwell Liquid Cooling ASIC AI Chip Server Memory DRAM Google TPU AI Server GPU HBM3 HBM4 Server GPU Contract Price CSP Market Share Market Size Pricing Trends Production Capacity Revenue Shipments Supply & Demand Samsung TSMC SK Hynix Micron Cambricon AMD
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