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CSP ASIC Demand Fuels Advanced Packaging Evolution

Last Modified

2026-09-11

Update Frequency

Aperiodically

Format

PDF

CSPs scale ASICs alongside GPUs, lifting packaging demand as CoWoS-L leads while EMIB-T and FOPLP emerge as new options.

Key Highlights

CSP Demand: CSPs scale ASICs with GPUs for efficient AI deployment.
Packaging: CoWoS-L stays dominant, fitting larger dies, more HBM.
New Option: Intel EMIB-T gains traction via TSV and routing gains.
Next-Gen: FOPLP and hybrid bonding lead future packaging efforts.

Table of Contents

Introduction
- Four Major North American CSPs Continue to Advance Their In-House ASIC Solutions, Thereby Driving the Development of Advanced Packaging Technology
CoWoS-L Is Expected to Remain as the Mainstream AI Chip Packaging Technology in 2028, but EMIB-T Will Also Emerge as a Viable Alternative Among CSPs
- Technology Roadmaps for TSMC's CoWoS and Intel’s EMIB
FOPLP Expected to Become Key Packaging Technology for Next-Gen AI Chips; Maturity Will Have to Wait Until 2028
- FOPLP Specifications among TSMC, ASE, and PTI in 2026
Next-Gen AI Chips to Expand Adoption of 3D Hybrid Bonding for Reinforcing Chip PPA
- Comparison between Micro Bump and Hybrid Bonding

<Total Pages: 8>

Technology Roadmaps for TSMC’s CoWoS and Intel’s EMIB

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