2027 Foundry Outlook: AI Demand Drives Expansion and Price Hikes

Last Modified

2026-11-11

Update Frequency

Aperiodically

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PDF

Server and AI demand keep foundry utilization high in 2027; tight 8-inch supply, 12-inch expansion and price hikes lift output value to a record.

Key Highlights

Output Outlook: Server and AI demand, new capacity, high utilization and price hikes drive record output value.
Advanced Nodes: TSMC focuses on 3nm and 2nm while accelerating 1.4nm; Samsung and Intel expand more cautiously.
Mature Nodes: 8-inch runs near full on cuts and AI power demand; 12-inch utilization recovers modestly.
Pricing: Cost pass-through and tight capacity lift prices; 8-inch gains are clear, 12-inch varies by node.

Global 12” Wafer Foundry Capacity to Grow 12% YoY; Aggressive Advanced Node Expansions to Slightly Outpace the Industry Average
- Changes in Advanced Node Capacity for TSMC, Samsung Foundry, and Intel, 2026-2027
- Global 8”and 12” Wafer Capacity Projections, 2026–2027
AI Chips and Peripheral ICs Drive Higher Wafer Consumption and Continued Capacity Crowding-Out; Global Foundry Utilization Remains High
- 8” Capacity Utilization among Top 10 Foundries (2026-2027F)
- 12” Capacity Utilization among Top 10 Foundries (2026-2027F)
Inflationary Cost Pass-Through and Tight Capacity Create Favorable Conditions for Price Hikes; Foundry Prices Projected to Rise by 5–20% in 2027

Changes in Advanced Node Capacity for TSMC, Samsung Foundry, and Intel, 2026-2027