With the generative AI market expanding at a CAGR of over 35%, data throughput for a single large language model (LLM) training task has reached the exabyte (EB) level. As transmission speeds evolve toward 1.6Tbps, traditional copper cables are hitting a “physical wall,” limiting transmission distances to under one meter and creating a massive energy drain. Leveraging cross-domain technologies like TSMC’s Compact Universal Photonic Engine (COUPE) advanced packaging and Micro LED mass transfer, Taiwan’s supply chain has built a comprehensive ecosystem—spanning wafer foundries and ASIC design to photoelectric testing. Consequently, Taiwan has become an indispensable strategic hub in the global AI computing infrastructure.

Key Highlights

• Bottleneck: The "Physical Wall" of Copper Interconnects and the Energy Dissipation Black Hole
• Innovation: CPO and the Extreme Efficiency of Micro LED Integration
• Strategic Hub: Taiwan’s Heterogeneous Integration as the Global Nexus for AI Compute  

Table of Contents

1. Making Sense of AI’s Extreme Demands on Data Center Bandwidth and New Standards for High-Speed Interconnects
   • Figure 1: AI Data Transmission: Advancing Past Physical Limits to Optoelectronic Integration with CPO
   • Figure 2: Evolution of GPU Cluster Transmission Specifications (2024-2026)
   • Figure 3: Product Lifecycle of Copper Cables
   • Table 1: Evaluation Matrix for Next-Generation Optical Interconnect Technologies
2. Dynamics of the International Supply Chain: The Gravitational Pull of Tech Giants and Breakthroughs by Startups
3. From Foundry to Optoelectronic Integration: Key Opportunities for Taiwan’s Supply Chain
   • Figure 4: From Substrates to Optical Dies: Home-Field Advantages of Taiwan’s Supply Chain
4. TRI’s View

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