This exhibition report focuses on two key components of near-eye displays—light engines and waveguides. By tracking the product development and capacity expansion of major suppliers, the report provid...
This report uncovers the overall Micro LED market size and provides an in-depth analysis of distinct Micro LED applications and manufacturer dynamics, spanning various glass-based display applications...
Driven by surging demand from AI data centers and ultra-high-speed transmission, Cloud Service Providers (CSPs) are actively securing capacity for Electro-absorption Modulated Lasers (EMLs) and Contin...
From a professional analyst's perspective, the global semiconductor market is strongly driven by surge in artificial intelligence and cloud computing, boosting high-performance chips and opti...
AI demand reshapes foundry priorities: photonics, packaging gains, tight mature nodes, rising power investment.
AI-driven demand displaces mature node capacity, triggering price hikes across 8-inch and 12-inch foundry that could last through 2027.
The year 2026 marks the watershed transition of AI data center optical interconnects from adoption to mass production. The actual volume driver is not scale-out CPO switches, but GPU scale-up networks...
Co-packaged optical (CPO) technology is entering the commercialization stage, driven by AI data center demand for higher bandwidth and lower power consumption. Volume production begins in 2026, with l...
Optical interconnects in AI data centers are shifting from legacy pluggable optics toward LPO, CPO and OCS. LPO streamlines the signal chain to improve power while keeping a pluggable model, CPO co‑pa...
Major foundries see rising utilization and pricing power, driven by front-loading demand and surging AI orders, lifting 2026 full-year outlook.
On April 23, 2026, TSMC unveiled at the 2026 North America Technology Symposium its Compact Universal Photonic Engine (COUPE) platform built on Co-Packaged Optics (CPO) technology, with mass productio...
As U.S. export controls extend from chips to AI infrastructure, the traditional optical interconnect industry is undergoing supply chain restructuring. While optical modules are not subject to blanket...
With the generative AI market expanding at a CAGR of over 35%, data throughput for a single large language model (LLM) training task has reached the exabyte (EB) level. As transmission speeds evolve t...
NVIDIA shifts AI competition from computing performance to system interconnects, leveraging CPO and silicon photonics to break I/O bottlenecks. By integrating high-speed fabric with advanced packaging...
Driven by strong demand, TSMC accelerates global expansions for advanced nodes and packaging; UMC pushes joint-node sampling despite delays and develops silicon photonics; Vanguard comprehensively rai...
