Download Report
Contact Us
Foundry Market Bulletin - Jul. 20, 2026
Last Modified
2026-07-20
Update Frequency
Biweekly
Format
AI demand reshapes foundry priorities: photonics, packaging gains, tight mature nodes, rising power investment.
Key Highlights
- Samsung: SiPh/PIC progress; cuts 8-inch for advanced nodes.
- SMIC: Shifts to memory; builds packaging (Foundry 2.0).
- HuaHong: Expands power/BCD; HLMC advances packaging.
- Nexchip: Tight supply drives price hikes, power push.
- Others: Zensemi expands power lines, funding limited.
Table of Contents
- Samsung
- SMIC
- HuaHong
- Nexchip
- Other Foundries
<Total Pages: 3>
Category: Wafer Foundries
Spotlight Report
-
DRAM Monthly Datasheet Jun. 2026
2026/06/16
Semiconductors
EXCEL
-
NAND Flash Monthly Datasheet Jul. 2026
2026/07/15
Semiconductors
PDF
-
3Q26 Memory Price Forecast
2026/06/30
Semiconductors
PDF
-
DRAM Contract Price May 2026
2026/05/29
Semiconductors
PDF
-
DRAM Contract Price Apr. 2026
2026/04/30
Semiconductors
PDF
-
AI Servers Absorbing LPDRAM Capacity, Signaling Tight Supply as the New Norm
2026/06/05
Semiconductors
PDF
Foundry Biweekly Market BulletinRelated Reports
Download Report
Membership
Spotlight Report
-
DRAM Monthly Datasheet Jun. 2026
2026/06/16
Semiconductors
EXCEL
-
NAND Flash Monthly Datasheet Jul. 2026
2026/07/15
Semiconductors
PDF
-
3Q26 Memory Price Forecast
2026/06/30
Semiconductors
PDF
-
DRAM Contract Price May 2026
2026/05/29
Semiconductors
PDF
-
DRAM Contract Price Apr. 2026
2026/04/30
Semiconductors
PDF
-
AI Servers Absorbing LPDRAM Capacity, Signaling Tight Supply as the New Norm
2026/06/05
Semiconductors
PDF