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Foundry Market Bulletin - Jul. 20, 2026

Last Modified

2026-07-20

Update Frequency

Biweekly

Format

PDF

AI demand reshapes foundry priorities: photonics, packaging gains, tight mature nodes, rising power investment.

Key Highlights

Samsung: SiPh/PIC progress; cuts 8-inch for advanced nodes.
SMIC: Shifts to memory; builds packaging (Foundry 2.0).
HuaHong: Expands power/BCD; HLMC advances packaging.
Nexchip: Tight supply drives price hikes, power push.
Others: Zensemi expands power lines, funding limited.

Table of Contents

Samsung
SMIC
HuaHong
Nexchip
Other Foundries

<Total Pages: 3>

Sector: Wafer Fabrication / Foundry IC Testing & Packaging

Tag: AI Chip DRAM Power IC Silicon Photonics Mobile Memory PIC Advanced Packaging ASP Capacity Utilization Rate CapEx Contract Price Market Bulletin Pricing Trends Production Capacity Revenue Shipments Supply & Demand Technology Roadmap Wafer Price Samsung SMIC HuaHong Nexchip Zensemi

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