Foundry Market Bulletin - Jun. 22, 2025
Last Modified
2026-06-22
Update Frequency
Biweekly
Format
Foundry pricing trends tighten across mature nodes in 2026, with AI demand driving advanced-process overflow orders and reshaping competitive dynamics.
Key Highlights
- Samsung Advanced Nodes: AI ASIC inquiries from Amazon Robotic and Anthropic noted, but limited capacity headroom due to HBM base die allocation and yield challenges at 2nm/4nm.
- SMIC Pricing Uptick: 12-inch HV and BCD platforms lead price hikes; NAND capacity nearly triples; AI displacement tightens mature node supply heading into 2027.
- HHGrace Platform Expansion: Further pricing upside narrows; 40nm Nor Flash IP collaboration targets 2H27 mass production, broadening technology offerings.
- Nexchip Utilization Peaks: 90nm aluminum fully loaded with backlog buildup; 55nm copper ramps quarterly; peer cutbacks drive order migration, sustaining high utilization through 2026.
Table of Contents
- Samsung
- SMIC
- HuaHong
- Nexchip
- Other Foundries
- Foundry Price Trends of 12'' among Chinese, South Korean, and US Foundries (2H25-2027F)
<Total Pages:3>

Category: Wafer Foundries
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