Optical interconnects in AI data centers are shifting from legacy pluggable optics toward LPO, CPO and OCS. LPO streamlines the signal chain to improve power while keeping a pluggable model, CPO co‑packages optics for higher density and efficiency, and OCS uses optical switching for large, dynamic AI networks, together forming key next‑generation infrastructure. 

Key Highlights

• Optical interconnects are evolving from pluggable optics to LPO, CPO and OCS to remove bandwidth and scaling bottlenecks in AI training clusters.  
• LPO eliminates DSPs and shortens electrical paths, cutting power and cost while preserving existing module ecosystems. 
• CPO integrates optical engines into switch packages, boosting efficiency and integration and becoming a key next‑generation AI data center architecture.
• OCS replaces electrical with optical switching, enabling large, dynamic AI networks and fabrics, and complements CPO in deployment.
• As optical upgrades advance, AI infrastructure limits shift from networking to compute and memory resources rather than bandwidth constraints. 

Table of Contents

1. Market Demand and Technology Upgrade Drivers for Optical Interconnects
2. From Pluggable Optics to Co-Packaged Optics and Optical Switching: A Diversifying Interconnect Landscape
3. Industry Implications of Optical Interconnect Technology Diversification: Opportunities and Risks for Taiwan’s Supply Chain
4. TRI’s View

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