Driven by surging AI computing demand and continued scaling of leading-edge logic processes, front-end wafer fab equipment (WFE) is seeing strong growth fueled by angstrom-class nodes and advanced memory technologies, including HBM, DRAM, and NAND Flash.

Meanwhile, back-end assembly and testing equipment is benefiting from growing demand for advanced packaging technologies such as CoWoS, SoIC, and hybrid bonding.

Amid U.S. and European export restrictions, China's semiconductor industry is pursuing a dual-track strategy centered on mature-node capacity expansion and advanced packaging development, while accelerating domestic equipment substitution.

Key Highlights

• Surging AI computing demand and the move to angstrom-class leading-edge nodes, together with advanced memory technologies such as HBM, DRAM and NAND Flash, are driving strong growth in front-end wafer fab equipment. 
• Rising demand for advanced packaging technologies such as CoWoS, SoIC and hybrid bonding is boosting momentum in back-end assembly and test equipment.
• Facing U.S. and European export restrictions, China is pursuing a dual-track strategy of expanding mature-node capacity and developing advanced packaging, and it is speeding up the replacement of foreign equipment with domestic tools.

Table of Contents

1. Global Semiconductor Equipment Market Landscape
   • Figure 1: Global Semiconductor Equipment Sales Forecast, 2024–2028
   • Figure 2: Global WFE Sales Forecast, 2024–2028
   • Figure 3: Global Lithography Equipment Market Forecast, 2024–2028
2. Technology Competition and Geopolitical Positioning Across the ATE and Testing Supply Chain
   • Table 1: Market Opportunities and Core Strengths of Advantest, Teradyne, and Cohu
   • Table 2: Objectives and Expected Benefits of the Advantest-OpenLight Collaboration
   • Table 3: China’s Semiconductor Equipment Market: Opportunities and Challenges Across Mature Nodes, Advanced Manufacturing, and Back-End Packaging and Testing
3. Diverging Angstrom-Scale Lithography Strategies and Surging Back-End Packaging Demand Highlight China’s Technological Barriers to Self-Sufficiency
4. TRI’s View

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