Driven by expanding AI clusters and surging bandwidth, the AI networking market will reach US$269.5B by 2027 (92% CAGR from 2024). Growth is extending from back-end networks to high-speed accelerator...
This exhibition report focuses on two key components of near-eye displays—light engines and waveguides. By tracking the product development and capacity expansion of major suppliers, the report provid...
This report uncovers the overall Micro LED market size and provides an in-depth analysis of distinct Micro LED applications and manufacturer dynamics, spanning various glass-based display applications...
Photonic packaging drives AI infra, shifting to mass production. CPO and glass platforms solve bottlenecks.
The year 2026 marks the watershed transition of AI data center optical interconnects from adoption to mass production. The actual volume driver is not scale-out CPO switches, but GPU scale-up networks...
Co-packaged optical (CPO) technology is entering the commercialization stage, driven by AI data center demand for higher bandwidth and lower power consumption. Volume production begins in 2026, with l...
Optical interconnects in AI data centers are shifting from legacy pluggable optics toward LPO, CPO and OCS. LPO streamlines the signal chain to improve power while keeping a pluggable model, CPO co‑pa...
On April 23, 2026, TSMC unveiled at the 2026 North America Technology Symposium its Compact Universal Photonic Engine (COUPE) platform built on Co-Packaged Optics (CPO) technology, with mass productio...
Mature foundries shift structurally as capacity cuts and AI demand lift utilization and pricing, while Tier 2 players gain order wins.
As U.S. export controls extend from chips to AI infrastructure, the traditional optical interconnect industry is undergoing supply chain restructuring. While optical modules are not subject to blanket...
Global Server Market – Trends and Outlook for 2Q26
With the generative AI market expanding at a CAGR of over 35%, data throughput for a single large language model (LLM) training task has reached the exabyte (EB) level. As transmission speeds evolve t...
NVIDIA shifts AI competition from computing performance to system interconnects, leveraging CPO and silicon photonics to break I/O bottlenecks. By integrating high-speed fabric with advanced packaging...
NVIDIA expands its AI factory via integrated GPU, CPU, and LPU racks for training and inference, securing its market lead.
NVIDIA's strategic investment in Lumentum and Coherent secures critical InP laser and high‑power CW light‑source capacity, shifting supply‑chain focus from module assembly to upstream optical componen...
