Mature Foundry Rebounds: AI ICs Drive Price Hike

Last Modified

2026-04-30

Update Frequency

Aperiodically

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PDF

Mature foundries shift structurally as capacity cuts and AI demand lift utilization and pricing, while Tier 2 players gain order wins.

Key Highlights

8-inch Tightness: Capacity cuts and power IC demand lift utilization, expected to stay high into next year.
12-inch Reshuffle: TSMC consolidates Fab12A/14A mature nodes, opening order overflow to Tier 2 and VSMC.
AI Tailwind: AI servers and peripheral ICs drive power, interposer, and CPO demand, reshaping allocation.
Supply Shift: HV and CIS orders migrate to Chinese foundries, lifting SMIC and Nexchip utilization rates.
Pricing Momentum: 8-inch and 12-inch foundries signal hikes, with negotiations turning increasingly assertive.

Introduction
Full Load of 8” Capacity to 1H27 to Trigger Full Price Hikes for Industry amidst Production Cuts on 8” among Major Foundries and Exponential Growth on Consumption of AI Power Wafers
- Price Changes from Major 8”Wafer Foundries, 2025-2026F
TSMC's 12-Inch Capacity Reduction and Taiwanese HV Capacity Shifts: Short-Term Rebound in Chinese Foundry Prices, Benefits for Mature Nodes in the Mid-to-Long Term
- TSMC's Plans for Reducing and Consolidation Fab Capacity for 12”Mature Nodes

Price Changes from Major 8” Wafer Foundries, 2025-2026F