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AI Ignites Chip Arms Race for Advanced Capacity
Last Modified
2026-04-28
Update Frequency
Aperiodically
Format
AI demand reshapes chip supply; advanced nodes and packaging turn scarce, with early lockdowns now defining leadership.
Key Highlights
- 3nm Squeeze: TSMC dominates as Samsung, Intel lag.
- CoWoS Spill: Orders flow to SPIL, Amkor, Intel EMIB.
- Design Shift: Larger chips drive CoWoP, CoPoS, and 3D packaging.
- Capacity: TSMC scales 3nm beyond 5/4nm; readies 2nm fabs.
- New Reality: AI race is now a supply chain arms race.
Table of Contents
- Introduction
- CoWoS Faces Chronic Shortages, EMIB Emerges, and SoIC Prepares for Takeoff
- Annual Global Production Capacity for 2.5D Packaging, 2023-2027
- Short Supply of Advanced Nodes Aggravates amidst Surging Demand for 3nm and Centralization among Foundries
- Distribution of TSMC's 3nm Clients (1Q25-4Q26)
- Expansion Plans on 3nm and 2nm among the Three Major Foundries of Advanced Nodes (2023-2030)
<Total Pages: 6>
Category: Wafer Foundries
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