2026 Outlook: TSMC vs. Intel in Advanced Packaging

Last Modified

2026-01-07

Update Frequency

Aperiodically

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PDF

Intel is expanding advanced packaging globally to secure CSP orders but trails TSMC in yield and turnkey solutions. Despite EMIB's technical challenges, the growing AI market offers opportunities for both, moving beyond a zero-sum game.

Key Highlights

Intel is expanding facilities in the US, Korea, and Malaysia to boost advanced packaging capacity.
TSMC retains a lead with its integrated turnkey solution and proven high yields compared to Intel.
Strong AI demand expands the market, allowing growth for both rather than a zero-sum competition.

Introduction
Intel Accelerates Investment in Capacity of Advanced Packaging to Seize ASIC Orders among CSPs
Yield Performance and Capacity Establishment of EMIB to Become Prominent Challenges for Intel
- Projected Capacity for TSMC's CoWoS and Intel’s EMIB (2024-2026)
Certain Technological Bottlenecks Remain in Development of EMIB, Prompting Most Customers to Adopt Cautious Stance

Projected Capacity for TSMC's CoWoS and Intel’s EMIB (2024-2026)