On April 23, 2026, TSMC unveiled at the 2026 North America Technology Symposium its Compact Universal Photonic Engine (COUPE) platform built on Co-Packaged Optics (CPO) technology, with mass production targeted for the second half of 2026. However, CPO testing is the critical technology that must be mastered before COUPE can move into a mass production phase. As a result, not only international giants such as FormFactor, ficonTEC, and Keysight, but also Taiwanese players including MPI, Chroma ATE, Hon Prec, Enlitech, and MSS have all rolled out corresponding solutions, hoping to capture share in this new incremental market.

This report mainly provides an in-depth analysis of: (1) demand drivers for CPO test equipment; (2) technical bottlenecks and testing challenges of CPO; (3) CPO test insertion levels; and (4) Taiwan-based CPO test equipment suppliers. The goal is to map out the growth drivers and technology development of CPO testing, and to take stock of the current state of Taiwan's CPO test equipment supply chain.

Key Highlights

• TSMC Reveals More COUPE Details: Disclosed further details of its CPO-based COUPE platform at North America Technology Symposium, targeting mass production later this year.
• CPO Testing as Critical Enabler: Mastering CPO testing technology is essential before the COUPE platform can transition into mass production phase.
• Global and Local Players Compete: Both international giants and Taiwanese suppliers have launched solutions to capture share in this emerging market.
• Report Covers Four Key Areas: Analysis includes CPO test equipment demand drivers, technical bottlenecks, test insertion levels, and Taiwan supply chain assessment.

Table of Contents

1. Demand Drivers for CPO Test Equipment
   • Figure 1: Diagram of TSMC's COUPE
   • Table 1: Evolution of Broadcom and NVIDIA CPO Switches
   • Figure 2: Diagram of Rail-Optimized Connectivity within a Single Rack
   • Figure 3: Diagram of Rail-Optimized Scale-Out for 8 Racks
   • Figure 4: Diagram of Rail-Optimized Scale-Out for 16 Racks
   • Table 2: Estimated CPO Switch / OE-to-GPU Ratios (Rail-Optimized)
   • Figure 5: TSMC Advanced-Process Capex Trend, 2022–2026
   • Figure 6: Capex Trend at TSMC's Advanced-Packaging and Major OSATs, 2022–2026
   • Figure 7: Share of SPE Capex by Process Equipment Category, 2023–2025
2. CPO Technology Bottlenecks and Testing Challenges
   • Figure 8: Cross-Sectional Area Difference Between Optical Fiber and Optical Waveguide
   • Figure 9: Diagram of Optical Probe Testing
   • Table 3: EIC vs. PIC Testing Requirements
3. CPO Test Insertion Levels
   • Table 4: CPO Test Insertion Levels and Corresponding Suppliers
   • Figure 10: Diagram of CPO Process Flow and Test Insertion Levels
4. Taiwan-Based CPO Test Equipment Suppliers
   • Figure 11: SoC Tester Market Size and Vendor Share, 2018–2025
   • Figure 12: Memory Tester Market Size and Vendor Share, 2018–2025
   • Figure 13: MPI SiPH Probe Systems
   • Figure 14: FormFactor OptoVue Pro
   • Figure 15: Teradyne & ficonTEC WLT-D2 Double-Sided Testing
   • Table 5: Specification Comparison: FormFactor and ficonTEC PIC Wafer-Level Test Solutions
   • Figure 16: Chroma ATE's CPO Test Product Portfolio
   • Figure 17: Hon Prec's CPO Test Product Portfolio
   • Figure 18: Enlitech's Night Jar Wafer-Level Optical Loss Mapping
   • Figure 19: MSS HG
   • Table 6: International and Taiwanese CPO Test Equipment Supply Chain
5. TRI’s View

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