AI demand reshapes foundry priorities: photonics, packaging gains, tight mature nodes, rising power investment.
AI-driven demand displaces mature node capacity, triggering price hikes across 8-inch and 12-inch foundry that could last through 2027.
The year 2026 marks the watershed transition of AI data center optical interconnects from adoption to mass production. The actual volume driver is not scale-out CPO switches, but GPU scale-up networks...
On April 23, 2026, TSMC unveiled at the 2026 North America Technology Symposium its Compact Universal Photonic Engine (COUPE) platform built on Co-Packaged Optics (CPO) technology, with mass productio...
As Co-Packaged Optics (CPO) moves from the lab toward commercialization, inspection has become the key to achieving mass producibility and long-term system stability. However, CPO inspection still fac...
