As Co-Packaged Optics (CPO) moves from the lab toward commercialization, inspection has become the key to achieving mass producibility and long-term system stability. However, CPO inspection still faces challenges such as tighter alignment‑accuracy requirements, insufficient automation, and the lack of established PIC test standards. To address these issues, traditional EIC test‑equipment vendors such as Advantest and Teradyne have in recent years begun partnering with PIC probing specialists like FormFactor and ficonTEC, while measurement‑instrument vendors such as Keysight and Enlitech have also introduced solutions that can be integrated into CPO inspection systems. 

This report therefore provides an in‑depth analysis of: (1) CPO technical bottlenecks and test challenges, (2) CPO test levels, (3) existing CPO inspection equipment and suppliers, as well as (4) supply‑chain opportunities for CPO test equipment. The aim is to help vendors understand CPO test technology developments and the competitive landscape of the supply chain.

Key Highlights

• Commercialization Challenge: Inspection critical for achieving mass production and system stability as CPO transitions from lab to market.
• Technical Bottlenecks: Tighter alignment accuracy, insufficient automation, and absence of established PIC testing standards. 
• Industry Collaboration: Traditional EIC test vendors partnering with PIC probing specialists to address challenges.
• Solution Integration: Measurement instrument providers developing integrated CPO inspection systems.
• Report Scope: In-depth examination of technical bottlenecks, test levels, equipment landscape, and supplier ecosystem. 
• Objective: Enable stakeholders to understand technology developments and supply-chain competitive dynamics. 

Table of Contents

1. CPO Technical Bottlenecks and Test Challenges
   • Figure 1: Schematics of TSMC’s COUPE
   • Figure 2: Differences in Cross-Sectional Area Between Optical Fiber and Optical Waveguide
   • Figure 3: Schematics of Optical Probes
   • Table 1: Requirements on EIC and PIC Testing
2. CPO Test Levels
   • Figure 4: Schematics of CPO Process and Testing of Each Layer
3. Existing CPO Inspection Equipment and Suppliers
   • Figure 5: Changes to Market Scale and Market Share among Vendors of SoC Testers (2018-2025)
   • Figure 6: Changes to Market Scale and Market Share among Vendors of Memory Testers (2018-2025)
   • Figure 7: UFO Probe Card from Advantest, Jenoptik, and Ayar Labs
   • Figure 8: V93000-Triton Photonic Test Solution from Advantest and FormFactor
   • Figure 9: FormFactor’s OptoVue Pro
   • Figure 10: WLT-D2 from Teradyne and ficonTEC
   • Figure 11: Chroma’s Model 58606
   • Figure 12: Measurement Results with Lamda Scan
   • Figure 13: EnliTech’s Night Jar: Wafer-Level Optical Loss Mapping
4. Opportunities in the CPO Testing Equipment Supply Chain
   • Figure 14: Breakdown of SPE Capital Expenditures by Process Equipment (2023-2025)
   • Table 2: Comparison of Specifications of Existing Wafer-Level PIC Testing Solutions
   • Table 3: CPO Testing Equipment Supply Chain
5. TRI’s View

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