TrendForce indicates that SK hynix has launched the industry's first HBM3e 16hi product, boosting maximum bit capacity to 384GB. This move aims to address the demand for higher-capacity HBM....
TrendForce indicates that the US is reportedly tightening scrutiny on Chinese customers' use of advanced AI chip manufacturing technologies, potentially impacting TSMC's ≤7nm advanced node s...
TrendForce indicates that the US is reportedly tightening scrutiny on Chinese customers' use of advanced AI chip manufacturing technologies, potentially impacting TSMC's ≤7nm advance...
TrendForce indicates that NVIDIA will adopt the SO-CAMM module design in its GB300 AI servers, replacing the initial onboard LPDDR5X solution for Grace CPUs. SO-CAMM offers advantages such as easy rep...
TrendForce forecasts a 25% YoY growth in DRAM bit output in 2025, with diverging market conditions across different product types and applications. HBM demand remains strong, leading to tight supply;...
TrendForce forecasts that shipments of liquid cooling solutions will surge with the launch of NVIDIA's Blackwell and B300 series AI servers. The GB200 NVL72 is expected to adopt a liquid-to-a...
The report provides an in-depth exploration of the applications and growing demand for ABF substrates in AI servers, autonomous vehicles, and high-performance computing (HPC). Furthermore, it provides...
TrendForce's report reveals that global channel market client SSD shipments grew by 3.7% YoY in 2023, driven by post-pandemic replacement demand and pre-emptive stocking in anticipation of NA...
TrendForce forecasts that global mature node capacity will grow by 6% YoY in 2025, with approximately 70% of the increase coming from Chinese foundries. Despite slow recovery in end-market demand, Chi...
TrendForce forecasts that NVIDIA will focus on promoting its Blackwell B300 series AI chips in 2025, with increased adoption of CoWoS-L packaging and liquid cooling solutions. The B300 series will rep...
1. AI Models and Technologies Used 2. The Relationship Between Computing and ICs 3. The Impact of AI on the IC Industry 4. AI Deployment by Major IC Design Companies 5. TRI’s View
TrendForce indicates that while Samsung, SK Hynix, and Micron have all sampled HBM3e 12hi products, challenges remain in yield ramp-up and qualification, leaving uncertainty over the risk of HBM overs...
TrendForce indicates that DDR4 and LPDDR4X prices are facing downward pressure due to sluggish consumer demand and CXMT's capacity expansion. Demand for DDR4 in PC, server, and consumer elect...
TrendForce forecasts that the AI server liquid cooling market will experience rapid growth, driven by the launch of NVIDIA's Blackwell platform and ASIC upgrades, with penetration rate projec...
(a) incentives for chip makers to adopt FOPLP solution: AI GPU makers pursuing chip packaging size expansion could adopt chip-last solution, while power IC and RF IC makers pursuing packaging cost red...
