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[Selected Topics] Manufacturing of HBM3e 12hi Products Requires Overcoming Learning Curve for Yield Rate and Challenges Related to Qualification; Uncertainty Remains over HBM Supply Surplus Risk in 2025

Last Modified

2024-09-25

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Aperiodically

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PDF

Overview

TrendForce indicates that while Samsung, SK Hynix, and Micron have all sampled HBM3e 12hi products, challenges remain in yield ramp-up and qualification, leaving uncertainty over the risk of HBM oversupply in 2025. Despite aggressive TSV capacity expansion by DRAM suppliers, the mass production learning curve for HBM3e 12hi is long, and AI chips demand higher stability, creating uncertainty in actual capacity release. TrendForce maintains its forecast of HBM accounting for 10% of total DRAM bit output in 2025 and contributing over 30% of DRAM market value. HBM3e market share will be a key differentiator in DRAM suppliers' profitability.

＜Total Pages：5＞

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[Selected Topics] Manufacturing of HBM3e 12hi Products Requires Overcoming Learning Curve for Yield Rate and Challenges Related to Qualification; Uncertainty Remains over HBM Supply Surplus Risk in 2025

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[Selected Topics] Manufacturing of HBM3e 12hi Products Requires Overcoming Learning Curve for Yield Rate and Challenges Related to Qualification; Uncertainty Remains over HBM Supply Surplus Risk in 2025

Overview

Spotlight Report

[Selected Topics] Trump’s Impact on Trade and Energy Policies between China and the U.S.

[Selected Topics] Capacity and Price Competitions to Intensify in China in 2025 amidst 6% YoY Growth in Global Mature Nodes (Approx. 70% from Chinese Foundries)

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[Selected Topics] Latest US Rules Targeting Direct Export of HBM Will Hinder Development of ASICs in China

[Selected Topics] With Arrival of Peak Sales Season, 3Q24 Smartphone Production Rose 7% QoQ and Remained Flat YoY

[Selected Topics] Apple’s New Devices and Early Stocking of Memory for GB200 Supported Positive Revenue Growth in 3Q24

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