Manufacturing of HBM3e 12hi Products Requires Overcoming Learning Curve for Yield Rate and Challenges Related to Qualification; Uncertainty Remains over HBM Supply Surplus Risk in 2025

Last Modified

2024-09-25

Update Frequency

Aperiodically

Format

PDF

TrendForce indicates that while Samsung, SK Hynix, and Micron have all sampled HBM3e 12hi products, challenges remain in yield ramp-up and qualification, leaving uncertainty over the risk of HBM oversupply in 2025. Despite aggressive TSV capacity expansion by DRAM suppliers, the mass production learning curve for HBM3e 12hi is long, and AI chips demand higher stability, creating uncertainty in actual capacity release. TrendForce maintains its forecast of HBM accounting for 10% of total DRAM bit output in 2025 and contributing over 30% of DRAM market value. HBM3e market share will be a key differentiator in DRAM suppliers' profitability.

＜Total Pages：5＞

Category: Semiconductors

Spotlight Report

Selected TopicsRelated Reports

High Server DRAM Demand Drives Expansion by Major Suppliers

2025/11/24

DRAM

PDF

2026 Global Data Center Trends: Rack Solutions

2025/11/20

AI Server/HBM/Server

PDF

AI Optical Networks Evolution: 2025 Efficiency and Sustainability Insights

2025/11/17

Telecommunications

PDF

CXMT: 2026 Output Growth & LPDDR4X Market Leadership

2025/11/13

DRAM

PDF

Server DRAM Price Surge: Long-Term Strategy & Capacity Race - From Q4 2025

2025/11/12

DRAM

PDF

AI Performance Drives Enterprise SSD Dominance in Storage - 2026 Trends

2025/11/12

NAND Flash

PDF

Download Report

USD $2,000

Membership

Selected Topics
Selected Topics-TF-0004_Manufacturing of HBM3e 12hi Products Requires Overcoming Learning Curve for Yield Rate and Challenges Related to Qualification; Uncertainty Remains over HBM Supply Surplus Risk in 2025

Popular Keywords

Research Reports

USD $2,000