The semiconductor industry is undergoing a structural shift in 2026, with competition moving beyond process node scaling toward system-level architecture. On the technology front, 2nm gate-all-around (GAA) structures offer ultra-low leakage through full gate control, addressing key challenges in edge AI. Meanwhile, advanced packaging technologies such as CoWoS have evolved into a strategic focal point for defining overall system performance.

On the application front, the need for inference is driving the rapid growth of ASICs, as companies like Amazon Web Services, Google, Meta, and Alibaba develop their own architectures and co-optimized software and hardware to regain control over compute resources. At the same time, AI-powered EDA tools are removing productivity hurdles and promoting design democratization, opening new avenues for IC innovation and encouraging wider ASIC adoption.

Key Highlights

• Competitive paradigm transition: From process node race to system-level architectural integration.
• Advanced foundry: Gate-all-around structures deliver ultra-low power consumption, solving edge AI implementation challenges.
• Packaging evolution: Advanced packaging emerges as strategic differentiator for overall system performance. 
• ASIC trend: Hyperscalers developing proprietary architectures with co-optimized hardware-software stacks to reclaim computing supremacy.
• Design democratization: AI-driven design automation tools breaking productivity barriers, fostering innovation diversity and broader chip development access.

Table of Contents

1. The Global Competitive Landscape of AI Chips
   • Figure 1: Global Logic IC Market Breakdown by Product Type (2025, Revenue-Based)
   • Figure 2: Quarterly Revenue Performance of Major Global IC Design Houses (2023–2025)
   • Figure 3: Market Share Distribution of Major Global IC Design Houses in 2025
2. CSPs Reshape AI Compute Economics and Energy Dynamics Through Vertical Integration
3. ASIC Customization and the Rise of the RISC-V Ecosystem in the AI 2.0 Era
4. Ecosystem Migration Risks and Regional Divergence in Advanced Packaging Yields
5. Beyond FinFET Limits: 2nm GAA and CoWoS Redefine AI Inference Performance
   • Figure 4: End-to-End Services for 2.5D/3D ASIC Design
6. AI for EDA Drives an Automation Revolution in Chip Design
7. TRI’s View

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