Research Reports

Research Reports

A New Era of IC Packaging: The Crucial Role and Market Outlook of ABF

Last Modified

2024-10-30

Update Frequency

Not

Format

PDF

Overview

Summary
The report provides an in-depth exploration of the applications and growing demand for ABF substrates in AI servers, autonomous vehicles, and high-performance computing (HPC). Furthermore, it provides an analysis of the activities and future development trends of major Taiwanese manufacturers, with a focus on strong, sustained market growth beyond 2025.

Table of Contents
1. ABF Substrate Market: Current Status
(1) AI-powered advancements propel high-end IC packaging
(2) ABF substrates driven by demand for HPC

2. AI Driven Growth Across Sectors: ABF Substrates as Catalysts for Innovation
(1) AI-powered PCs poised to drive recovery of ABF demand
(2) AI drives surging server demand and fuels rapid growth in ABF substrates
(3) New opportunities for substrates driven by AI and high-frequency network deployment
(4) Electrification and autonomous driving fuel growth for ABF demand

3.Updates on Taiwanese Manufacturers
(1) Unimicron
(2) Nan Ya PCB
(3) Kinsus

4.TRI’s View
(1) Surging demand for ABF substrates highlights need for supply chain resilience
(2) Substrate industry faces short-term pressures and expands capacity to meet AI demand
(3) Outlook for the ABF substrate market in 2025: Growth driven by AI servers and automotive
applications

＜Total Pages：12＞