FOPLP to Accommodate Different Types of Suppliers with Market Segmentation

Last Modified

2024-09-04

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(a) incentives for chip makers to adopt FOPLP solution: AI GPU makers pursuing chip packaging size expansion could adopt chip-last solution, while power IC and RF IC makers pursuing packaging cost reduction could adopt chip-first solution. The segmented market could accommodate different types of suppliers.

(b) development of FOPLP solution by foundry: expanding chip packaging size of 2.5D packaging for AI GPU from wafer level to panel level.

(c) development of FOPLP solution by OSATs: migrating from power IC and RF IC to CPU and GPU, enabling multi-chip packaging.

(d) development of FOPLP solution by panel makers: entry into chip packaging business, supported by licencers.

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Category: Semiconductors