Driven by AI infrastructure, major DRAM makers shift capacity to advanced nodes, tightening mature processes. To secure supply and control costs, brands downgrade to older generation consumer DRAM, shifting shortages from DDR4 down to DDR2 and boosting prices. Taiwanese suppliers pivot strategies accordingly, reflecting a persistent global structural DRAM shortage.

Key Highlights

• Capacity Shift to Advanced Nodes: Surging AI infrastructure demand prompts top DRAM makers to prioritize advanced processes, causing a structural supply crunch in mature consumer DRAM.
• Cascading Demand and Downgrading: To control costs and secure allocations, downstream brands and ODMs downgrade specifications to older generations (from DDR4 to DDR3/DDR2), driving up contract prices for legacy chips.
• Taiwanese Suppliers Shift Strategies: Experiencing enhanced bargaining power, Winbond is exiting legacy production to focus on higher-margin mainstreams, while ESMT expands legacy output to maximize profit and fill the supply gap.
• Persistent Structural Deficit: The rush for legacy generations underscores that the overall global DRAM supply tightens and the supply-demand deficit continues to unfold.

Table of Contents

1. Consumer DRAM Shortage Ripples Across Process Generations; Suppliers Adjust Strategies, but Undersupply Persists
2. Major Consumer DRAM Suppliers Diverge in Strategy: Winbond Gradually Exits DDR2 Production While ESMT Expands DDR2 Wafer Inputs
3. Cascading Consumer DRAM Shortages Highlight Broad Market Tightness
   • Projection on Price Trend of 512Mb DDR2

<Total Pages: 5>